SNVS731B September   2011  – June 2019 LMR12010

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Descriptions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Ratings
    3. 6.3 Electrical Characteristics
    4. 6.4 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Boost Function
      2. 7.3.2 Enable Pin / Shutdown Mode
      3. 7.3.3 Soft Start
      4. 7.3.4 Output Overvoltage Protection
      5. 7.3.5 Undervoltage Lockout
      6. 7.3.6 Current Limit
      7. 7.3.7 Thermal Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1.      Typical Application
      2. 8.2.1 Detailed Design Procedure
        1. 8.2.1.1 Custom Design With WEBENCH® Tools
        2. 8.2.1.2 Inductor Selection
        3. 8.2.1.3 Input Capacitor
        4. 8.2.1.4 Output Capacitor
        5. 8.2.1.5 Catch Diode
        6. 8.2.1.6 Boost Diode
        7. 8.2.1.7 Boost Capacitor
        8. 8.2.1.8 Output Voltage
        9. 8.2.1.9 Calculating Efficiency, and Junction Temperature
      3. 8.2.2 Application Curves
  9. 9 Layout
    1. 9.1 Layout Considerations
    2. 9.2 Calculating The LMR12010 Junction Temperature
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Custom Design With WEBENCH® Tools
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Community Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DDC|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Electrical Characteristics

Specifications with standard typeface are for TJ = 25°C, and those in boldface type apply over the full Operating Temperature Range (TJ = -40°C to 125°C). VIN = 5 V, VBOOST - VSW = 5V unless otherwise specified. Datasheet min/max specification limits are specified by design, test, or statistical analysis.
PARAMETER TEST CONDITIONS MIN(4) TYP(5) MAX(4) UNIT
VFB Feedback Voltage 0.784 0.800 0.816 V
ΔVFB/ΔVIN Feedback Voltage Line Regulation VIN = 3V to 20V 0.01 % / V
IFB Feedback Input Bias Current Sink/Source 10 250 nA
UVLO Undervoltage Lockout VIN Rising 2.74 2.90 V
Undervoltage Lockout VIN Falling 2.0 2.3
UVLO Hysteresis 0.30 0.44 0.62
FSW Switching Frequency LMR12010X 1.2 1.6 1.9 MHz
LMR12010Y 2.2 3.0 3.6
DMAX Maximum Duty Cycle LMR12010X 85% 92%
LMR12010Y 78% 85%
DMIN Minimum Duty Cycle LMR12010X 2%
LMR12010Y 8%
RDS(ON) Switch ON Resistance VBOOST - VSW = 3V 300 600 mΩ
ICL Switch Current Limit VBOOST - VSW = 3V 1.2 1.7 2.5 A
IQ Quiescent Current Switching 1.5 2.5 mA
Quiescent Current (shutdown) VEN = 0V 30 nA
IBOOST Boost Pin Current LMR12010X (50% Duty Cycle) 2.5 3.5 mA
LMR12010Y (50% Duty Cycle) 4.25 6.0
VEN_TH Shutdown Threshold Voltage VEN Falling 0.4 V
Enable Threshold Voltage VEN Rising 1.8
IEN Enable Pin Current Sink/Source 10 nA
ISW Switch Leakage 40 nA
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended operating ratings indicate conditions for which the device is intended to be functional, but specific performance is not verified. For verified specifications and the test conditions, see Electrical Characteristics
(2) Human body model, 1.5kΩ in series with 100pF.
(3) Thermal shutdown will occur if the junction temperature exceeds 165°C. The maximum power dissipation is a function of TJ(MAX) , θJA and TA . The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/θJA . All numbers apply for packages soldered directly onto a 3” x 3” PC board with 2oz. copper on 4 layers in still air. For a 2 layer board using 1 oz. copper in still air, θJA = 204°C/W.
(4) Specified to Average Outgoing Quality Level (AOQL).
(5) Typicals represent the most likely parametric norm.