SNVS691H January   2011  – October 2015 LMZ14202H

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 COT Control Circuit Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Overvoltage Comparator
      2. 7.3.2 Current Limit
      3. 7.3.3 Thermal Protection
      4. 7.3.4 Zero Coil Current Detection
      5. 7.3.5 Prebiased Start-Up
    4. 7.4 Device Functional Modes
      1. 7.4.1 Discontinuous Conduction and Continuous Conduction Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Design Steps for the LMZ14202H Application
          1. 8.2.2.1.1 Enable Divider, RENT and RENB Selection
          2. 8.2.2.1.2 Output Voltage Selection
          3. 8.2.2.1.3 Soft-Start Capacitor, CSS, Selection
          4. 8.2.2.1.4 Output Capacitor, CO, Selection
            1. 8.2.2.1.4.1 Capacitance
            2. 8.2.2.1.4.2 ESR
          5. 8.2.2.1.5 Input Capacitor, CIN, Selection
          6. 8.2.2.1.6 ON-Time, RON, Resistor Selection
            1. 8.2.2.1.6.1 Discontinuous Conduction and Continuous Conduction Modes Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Power Module SMT Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation and Board Thermal Requirements
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)(3)
MIN MAX UNIT
VIN, RON to GND –0.3 43.5 V
EN, FB, SS to GND –0.3 7 V
Junction Temperature 150 °C
Peak Reflow Case Temperature
(30 s)		 245 °C
Storage Temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.
(3) For soldering specifications, refer to the following document: SNOA549

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN 6 42 V
EN 0 6.5 V
Operation Junction Temperature −40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) LMZ14202H UNIT
NDW (TO-PMOD)
7 PINS
RθJA Junction-to-ambient thermal resistance 4-layer Printed-Circuit-Board, 7.62 cm × 7.62 cm (3 in × 3 in) area, 1-oz Copper, No air flow 16 °C/W
4-layer Printed-Circuit-Board, 6.35 cm × 6.35 cm (2.5 in × 2.5 in) area, 1-oz Copper, No air flow 18.4
RθJC(top) Junction-to-case (top) thermal resistance No air flow 1.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Limits are for TJ = 25°C unless otherwise specified. Minimum and Maximum limits are ensured through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the following conditions apply: VIN = 24 V, VOUT = 12 V, RON = 249 kΩ
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
SYSTEM PARAMETERS
ENABLE CONTROL
VEN EN threshold trip point VEN rising 1.18 V
over the junction temperature (TJ) range of –40°C to +125°C 1.1 1.25
VEN-HYS EN threshold hysteresis 90 mV
SOFT-START
ISS SS source current VSS = 0 V 10 µA
over the junction temperature (TJ) range of –40°C to +125°C 8 15
ISS-DIS SS discharge current -200 µA
CURRENT LIMIT
ICL Current limit threshold DC average 3.2 A
over the junction temperature (TJ) range of –40°C to +125°C 2.4 3.95
VIN UVLO
VINUVLO Input UVLO EN pin floating
VIN rising		 3.75 V
VINUVLO-HYST Hysteresis EN pin floating
VIN falling		 130 mV
ON/OFF TIMER
tON-MIN ON timer minimum pulse width 150 ns
tOFF OFF timer pulse width 260 ns
REGULATION AND OVERVOLTAGE COMPARATOR
VFB In-regulation feedback voltage VIN = 24 V, VOUT = 12 V
VSS >+ 0.8 V
TJ = -40°C to 125°C
IOUT = 10 mA to 2 A		 0.803 V
over the junction temperature (TJ) range of –40°C to +125°C 0.782 0.822
VIN = 24 V, VOUT = 12 V VSS >+ 0.8 V
TJ = 25°C
IOUT = 10 mA to 2 A		 0.786 0.803 0.818
VFB In-regulation feedback voltage VIN = 36 V, VOUT = 24 V
VSS >+ 0.8 V
TJ = -40°C to 125°C
IOUT = 10 mA to 2 A		 0.803 V
over the junction temperature (TJ) range of –40°C to +125°C 0.780 0.824
VIN = 36 V, VOUT = 24 V VSS >+ 0.8 V
TJ = 25°C
IOUT = 10 mA to 2 A		 0.787 0.803 0.819
VFB-OVP Feedback overvoltage protection threshold 0.92 V
IFB Feedback input bias current 5 nA
IQ Nonswitching Input Current VFB= 0.86 V 1 mA
ISD Shut Down Quiescent Current VEN= 0 V 25 μA
THERMAL CHARACTERISTICS
TSD Thermal Shutdown Rising 165 °C
TSD-HYST Thermal Shutdown Hysteresis 15 °C
PERFORMANCE PARAMETERS
ΔVOUT Output Voltage Ripple VOUT = 5 V, CO = 100 µF 6.3 V X7R 8 mV PP
ΔVOUT/ΔVIN Line Regulation VIN = 16 V to 42 V, IOUT= 3 A .01%
ΔVOUT/ΔIOUT Load Regulation VIN = 24 V, IOUT = 0 A to 2 A 1.5 mV/A
η Efficiency VIN = 24 V, VOUT = 12 V IOUT = 1 A 93%
η Efficiency VIN = 24 V, VOUT = 12 V IOUT = 2 A 92%
(1) Minimum and Maximum limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) Typical numbers are at 25°C and represent the most likely parametric norm.

6.6 Typical Characteristics

Unless otherwise specified, the following conditions apply: VIN = 24 V; CIN = 10-uF X7R Ceramic; CO = 47 uF; TA = 25°C.
LMZ14202H 30135512.gif
Figure 1. Efficiency VOUT = 5 V TA = 25°C
LMZ14202H 30135507.gif
Figure 3. Efficiency VOUT = 12 V TA = 25°C
LMZ14202H 30135509.gif
Figure 5. Efficiency VOUT = 15 V TA = 25°C
LMZ14202H 30135549.gif
Figure 7. Efficiency VOUT = 18 V TA = 25°C
LMZ14202H 30135547.gif
Figure 9. Efficiency VOUT = 24 V TA = 25°C
LMZ14202H 30135540.gif
Figure 11. Efficiency VOUT = 30 V TA = 25°C
LMZ14202H 30135515.gif
Figure 13. Efficiency VOUT = 5 V TA = 85°C
LMZ14202H 30135514.gif
Figure 15. Efficiency VOUT = 12 V TA = 85°C
LMZ14202H 30135542.gif
Figure 17. Efficiency VOUT = 15 V TA = 85°C
LMZ14202H 30135544.gif
Figure 19. Efficiency VOUT = 18 V TA = 85°C
LMZ14202H 30135538.gif
Figure 21. Efficiency VOUT = 24 V TA = 85°C
LMZ14202H 30135536.gif
Figure 23. Efficiency VOUT = 30 V TA = 85°C
LMZ14202H 30135532.gif
Figure 25. Thermal Derating VOUT = 12 V, RθJA = 16°C/W
LMZ14202H 30135531.gif
Figure 27. Thermal Derating VOUT = 24 V, RθJA = 16°C/W
LMZ14202H 30135553.gif
Figure 29. Thermal Derating VOUT = 30 V, RθJA = 16°C/W
LMZ14202H 30135527.gif
Figure 31. Package Thermal Resistance RθJA
4-Layer Printed-Circuit-Board With 1-oz Copper
LMZ14202H 30135505_nvs691.gif
Figure 33. Output Ripple
VIN = 12 V, IOUT = 2 A, Ceramic COUT, BW = 200 MHz
LMZ14202H 30135503_nvs691.gif
Figure 35. Load Transient Response VIN = 24 V, VOUT = 12 V
Load Step from 10% to 100%
LMZ14202H 30135521.gif
Figure 37. Current Limit vs. Input Voltage
VOUT = 5 V TA = 25°C
LMZ14202H 30135522.gif
Figure 39. Current Limit vs. Input Voltage
VOUT = 12 V TA = 25°C
LMZ14202H 30135523.gif
Figure 41. Current Limit vs. Input Voltage
VOUT = 24 V TA = 25°C
LMZ14202H 30135556.gif
Figure 43. Start-Up
VIN = 24 V IOUT = 2 A
LMZ14202H 30135524.gif
Figure 45. Conducted EMI, VOUT = 12 V
Evaluation Board BOM and 3.3-µH 2×10-µF LC line filter
LMZ14202H 30135510.gif
Figure 2. Power Dissipation VOUT = 5 V TA = 25°C
LMZ14202H 30135516.gif
Figure 4. Power Dissipation VOUT = 12 V TA = 25°C
LMZ14202H 30135550.gif
Figure 6. Power Dissipation VOUT = 15 V TA = 25°C
LMZ14202H 30135548.gif
Figure 8. Power Dissipation VOUT = 18 V TA = 25°C
LMZ14202H 30135546.gif
Figure 10. Power Dissipation VOUT = 24 V TA = 25°C
LMZ14202H 30135539.gif
Figure 12. Power Dissipation VOUT = 30 V TA = 25°C
LMZ14202H 30135545.gif
Figure 14. Power Dissipation VOUT = 5 V TA = 85°C
LMZ14202H 30135513.gif
Figure 16. Power Dissipation VOUT = 12 V T = 85°C
LMZ14202H 30135541.gif
Figure 18. Power Dissipation VOUT = 15 V TA = 85°C
LMZ14202H 30135543.gif
Figure 20. Power Dissipation VOUT = 18 V TA = 85°C
LMZ14202H 30135537.gif
Figure 22. Power Dissipation VOUT = 24 V TA = 85°C
LMZ14202H 30135535.gif
Figure 24. Power Dissipation VOUT = 30 V TA = 85°C
LMZ14202H 30135529.gif
Figure 26. Thermal Derating VOUT = 12 V, RθJA = 20°C/W
LMZ14202H 30135528.gif
Figure 28. Thermal Derating VOUT = 24 V, RθJA = 20°C/W
LMZ14202H 30135554.gif
Figure 30. Thermal Derating VOUT = 30 V, RθJA = 20°C/W
LMZ14202H 30135555.gif
Figure 32. Line and Load Regulation TA = 25°C
LMZ14202H 30135504.gif
Figure 34. Output Ripple
VIN = 24 V, IOUT = 2 A, Polymer Electrolytic COUT, BW = 200 MHz
LMZ14202H 30135506.gif
Figure 36. Load Transient Response VIN = 24 V, VOUT = 12 V
Load Step from 30% to 100%
LMZ14202H 30135518.gif
Figure 38. Switching Frequency vs. Power Dissipation
VOUT = 5 V TA = 25°C
LMZ14202H 30135519.gif
Figure 40. Switching Frequency vs. Power Dissipation
VOUT = 12 V TA = 25°C
LMZ14202H 30135520.gif
Figure 42. Switching Frequency vs. Power Dissipation
VOUT = 24 V TA = 25°C
LMZ14202H 30135525.gif
Figure 44. Radiated EMI of Evaluation Board, VOUT = 12 V