SNVS337F June   2006  – September 2015 LP38859

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  6. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Voltage
      2. 6.3.2 Bias Voltage
      3. 6.3.3 Undervoltage Lockout
      4. 6.3.4 Supply Sequencing
      5. 6.3.5 Reverse Voltage
      6. 6.3.6 Soft-Start
    4. 6.4 Device Functional Modes
      1. 6.4.1 Operation with 3 V ≤ VBIAS ≤ 5.5 V, VOUT(TARGET)+ 0.3 V ≤ VIN ≤ VBIAS
  7. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 External Capacitors
          1. 7.2.2.1.1 Output Capacitor
          2. 7.2.2.1.2 Input Capacitor
          3. 7.2.2.1.3 Bias Capacitor
        2. 7.2.2.2 Power Dissipation and Heat-Sinking
      3. 7.2.3 Application Curves
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Community Resources
    2. 10.2 Trademarks
    3. 10.3 Electrostatic Discharge Caution
    4. 10.4 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Device and Documentation Support

10.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

10.2 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

10.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

10.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.