SBOSAC5 December   2022 OPT3005

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Human Eye Matching
      2. 8.3.2 Automatic Full-Scale Range Setting
      3. 8.3.3 Interrupt Operation, INT Pin, and Interrupt Reporting Mechanisms
      4. 8.3.4 I2C Bus Overview
        1. 8.3.4.1 Serial Bus Address
        2. 8.3.4.2 Serial Interface
    4. 8.4 Device Functional Modes
      1. 8.4.1 Automatic Full-Scale Setting Mode
      2. 8.4.2 Interrupt Reporting Mechanism Modes
        1. 8.4.2.1 Latched Window-Style Comparison Mode
        2. 8.4.2.2 Transparent Hysteresis-Style Comparison Mode
        3. 8.4.2.3 End-of-Conversion Mode
        4. 8.4.2.4 End-of-Conversion and Transparent Hysteresis-Style Comparison Mode
    5. 8.5 Programming
      1. 8.5.1 Writing and Reading
        1. 8.5.1.1 High-Speed I2C Mode
        2. 8.5.1.2 General-Call Reset Command
        3. 8.5.1.3 SMBus Alert Response
    6. 8.6 Register Maps
      1. 8.6.1 Internal Registers
        1. 8.6.1.1 Register Descriptions
          1. 8.6.1.1.1 Result Register (offset = 00h)
          2. 8.6.1.1.2 Configuration Register (offset = 01h) [reset = C810h]
          3. 8.6.1.1.3 Low-Limit Register (offset = 02h) [reset = C0000h]
          4. 8.6.1.1.4 High-Limit Register (offset = 03h) [reset = BFFFh]
          5. 8.6.1.1.5 Manufacturer ID Register (offset = 7Eh) [reset = 5449h]
          6. 8.6.1.1.6 Device ID Register (offset = 7Fh) [reset = 3001h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Electrical Interface
      2. 9.1.2 Optical Interface
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Optomechanical Design
        2. 9.2.2.2 Dark Window Selection and Compensation
      3. 9.2.3 Application Curves
    3. 9.3 Do's and Don'ts
    4. 9.4 Power-Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
      3. 9.5.3 Soldering and Handling Recommendations
      4. 9.5.4 Mechanical Drawings
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.5.4 Mechanical Drawings

Figure 9-7 Package Orientation Visual Reference of Pin 1 (Top View) & Sectional View

Identifying Package Orientation Using Automated Optical Inspection (AOI) Systems

Automated optical inspection (AOI) systems are used in the PCB assembly process to identify the device orientation during device placement. Typically, on non-optical packages, the pin 1 marker is a white dot or indentation on the black package. This is used by the AOI system to orient the package. Light sensor ICs such as OPT3005 utilize a transparent package to allow light to enter the package and reach the sensor. This section provides instruction for determining orientation on the package. The following figures show how the package can be oriented from the bottom and top side. On the bottom side the package has a pin 1 identifier. On the top side there are four features that can be used to orient the device. 1) the pin 1 identifier can be seen through the package. 2) and 3) the bond wires and bond pads on the die can also be used. The asymmetry in either wires or pads (4 at the top and 2 at the bottom) can be used to orient the device. 4) the rectangular feature on the die indicates orientation.

GUID-20221031-SS0I-WF7V-HZXN-GQPMQXMVTJBB-low.png Figure 9-8 Identifying Package Orientation - Backside
GUID-20221031-SS0I-JJMX-D9WT-FTX0F32P8SQV-low.png Figure 9-9 Identifying Package Orientation - Topside