SCPS069G July   2001  – August 2021 PCF8574A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
      1. 8.2.1 Simplified Block Diagram of Device
      2. 8.2.2 Simplified Schematic Diagram of Each P-Port Input/Output
    3. 8.3 Feature Description
      1. 8.3.1 I2C Interface
      2. 8.3.2 Interface Definition
      3. 8.3.3 Address Reference
    4. 8.4 Device Functional Modes
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Minimizing ICC When I/Os Control LEDs
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power-On Reset Requirements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Glossary
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGV|20
  • DW|16
  • N|16
  • PW|20
  • RGY|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) PCF8574 UNIT
DGV DW N PW RGY
20 PINS 16 PINS 16 PINS 20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance 112.2 79.7 48.3 99.5 41.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 35.2 42.5 35.6 34.5 42.5 °C/W
RθJB Junction-to-board thermal resistance 53.4 44.4 28.2 50.5 16.9 °C/W
ψJT Junction-to-top characterization parameter 1.8 14.8 20.5 2.0 0.8 °C/W
ψJB Junction-to-board characterization parameter 52.8 43.8 28.1 49.9 16.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a n/a 5.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.