SGDS010E September   1998  – May 2024 SN74AHC08Q-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Description
  4. 3Pin Configuration and Functions
  5. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    7. 4.7 Switching Characteristics, VCC = 5 V ± 0.5 V
    8. 4.8 Noise Characteristics
    9. 4.9 Operating Characteristics
  6. 5Parameter Measurement Information
  7. 6Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Device Functional Modes
  8. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • PW|14
  • BQA|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Revision History

Changes from Revision D (June 2023) to Revision E (May 2024)

  • Added body size to Package Information tableGo
  • Added BQA pinout to Pin Configuration and Functions section Go

Changes from Revision C (April 2008) to Revision D (June 2023)

  • Added Package Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Device Functional Modes, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Added BQA package to Package Information tableGo
  • Updated thermal values for PW package from RθJA = 113 to 147.7, all values in °C/WGo
  • Added thermal value for RθJA: BQA = 88.3, all values in °C/WGo