SGDS022B February   2002  – March 2024 SN74AHCT138Q-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Switching Characteristics
    7. 4.7 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Power Supply Recommendations
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
      2. 7.3.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Related Links
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Pin Configuration and Functions

GUID-C9C1B949-AF6B-4CE0-AEA3-C8E06CE8BB9E-low.pngD or PW Package, 16-Pin SOIC or TSSOP (Top View)
GUID-20240327-SS0I-M072-JFCN-BHZ2Z3HHJVRD-low.gifBQB Package, 16-Pin WBQB (Top View)
PIN I/O(1) DESCRIPTION
NAME
SOIC, TSSOP, WQFN
A 1 I Select input A (least significant bit)
B 2 I Select input B
C 3 I Select input C (most significant bit)
G2A 4 I Active low enable A
G2B 5 I Active low enable B
G1 6 I Active high enable
GND 8 — Ground
NC — — No internal connection
VCC 16 — Supply voltage
Y0 15 O Output 0 (least significant bit)
Y1 14 O Output 1
Y2 13 O Output 2
Y3 12 O Output 3
Y4 11 O Output 4
Y5 10 O Output 5
Y6 9 O Output 6
Y7 7 O Output 7 (most significant bit)
Thermal pad(2) The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
(1) Signal Types: I = Input, O = Output, I/O = Input or Output, P = Power, G = Ground.
(2) WBQB package only.