SGDS022B February   2002  – March 2024 SN74AHCT138Q-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Description
  4. Pin Configuration and Functions
  5. Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Switching Characteristics
    7. 4.7 Operating Characteristics
  6. Parameter Measurement Information
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Power Supply Recommendations
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
      2. 7.3.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Related Links
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • BQB|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

The SN74AHCT138Q 3-line to 8-line decoder/demultiplexer is designed to be used in high-performance memory-decoding and data-routing applications that require very short propagation-delay times. In high-performance memory systems, this decoder can be used to minimize the effects of system decoding. When employed with high-speed memories utilizing a fast enable circuit, the delay times of this decoder and the enable time of the memory usually are less than the typical access time of the memory. This means that the effective system delay introduced by the decoder is negligible.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2) BODY SIZE(3)
SN74AHCT138Q-Q1 BQB (WQFN, 16) 3.5mm x 2.5mm 3.5mm x 2.5mm
D (SOIC, 16) 9.9mm x 6mm 9.9mm x 3.9mm
PW (TSSOP, 16) 5.00mm x 6.4mm 5.00mm x 4.40mm
For more information, see Section 10.
The package size (length × width) is a nominal value and includes pins, where applicable.
The body size (length × width) is a nominal value and does not include pins.
GUID-638CE3F0-9071-4E40-A51B-6B5E1F0FB931-low.jpgLogic Diagram (Positive Logic)