SCES502Q November   2003  – March 2024 SN74AUP1G08

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, CL = 5 pF
    7. 5.7  Switching Characteristics, CL = 10 pF
    8. 5.8  Switching Characteristics, CL = 15 pF
    9. 5.9  Switching Characteristics, CL = 30 pF
    10. 5.10 Operating Characteristics
    11. 5.11 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Propagation Delays, Setup and Hold Times, and Pulse Duration
    2. 6.2 Enable and Disable Times
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DPW|5
  • DBV|5
  • DSF|6
  • DCK|5
  • YFP|6
  • DRL|5
  • DRY|6
  • YZP|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Revision History

Changes from Revision P (June 2016) to Revision Q (March 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the document Go

Changes from Revision O (June 2014) to Revision P (June 2016)

  • Updated Applications and Device Information tableGo
  • Updated pinout images and Pin Functions tableGo
  • Added temperature ranges for Storage temperature, Tstg and Junction temperature, TJ in Absolute Maximum Ratings Go
  • Changed Handling Ratings to ESD Ratings and changed MIN, MAX column to a VALUE columnGo

Changes from Revision N (November 2012) to Revision O (June 2014)

  • Updated document to new TI data sheet format.Go
  • Removed ordering information.Go
  • Added Applications.Go
  • Fixed typo in YFP package drawing. Go
  • Added Handling Ratings tableGo
  • Added Thermal Information table.Go
  • Added Typical Characteristics.Go

Changes from Revision M (September 2012) to Revision N (November 2012)

  • Changed DPW package pinoutGo

Changes from Revision L (May 2012) to Revision M (September 2012)

    Changes from Revision K (October 2011) to Revision L (May 2012)

    • Revised document to fix package addendum issue.Go

    Changes from Revision J (May 2010) to Revision K (October 2011)