SCES517K December   2003  – November 2023 SN74AVC8T245

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 1.2 V
    7. 5.7  Switching Characteristics, VCCA = 1.5 V ± 0.1 V
    8. 5.8  Switching Characteristics, VCCA = 1.8 V ± 0.15 V
    9. 5.9  Switching Characteristics, VCCA = 2.5 V ± 0.2 V
    10. 5.10 Switching Characteristics, VCCA = 3.3 V ± 0.3 V
    11. 5.11 Operating Characteristics
    12. 5.12 Typical Total Static Power Consumption (ICCA + ICCB)
    13. 5.13 Typical Characteristics
  7.   Parameter Measurement Information
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Fully Configurable Dual-Rail Design
      2. 6.3.2 Support High-Speed Translation
      3. 6.3.3 Ioff Supports Partial-Power-Down Mode Operation
      4. 6.3.4 Balanced High-Drive CMOS Push-Pull Outputs
      5. 6.3.5 Vcc Isolation
    4. 6.4 Device Functional Modes
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGV|24
  • RHL|24
  • PW|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision J (March 2017) to Revision K (November 2023)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated the Package Information table to include package lead sizeGo
  • Updated the Thermal Information table for all packagesGo

Changes from Revision I (December 2014) to Revision J (March 2017)

  • Changed MAX value for Operating free-air temperature, TA from: 85°C to: 125°CGo
  • Added values for TA = –40°C to +125°C in Electrical Characteristics and all Switching Characteristics tablesGo
  • Added Documentation Support section, Receiving Notification of Documentation Updates, and Community Resources sectionGo

Changes from Revision H (February 2007) to Revision I (December 2014)

  • Added Pin Configuration and Functions section, ESD Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go