SCES598F July   2004  – April 2024 SN74AVCH1T45

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Description (continued)
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, VCCA= 1.2V
    7. 6.7  Switching Characteristics, VCCA= 1.5V ± 0.1V
    8. 6.8  Switching Characteristics, VCCA= 1.8V ± 0.15V
    9. 6.9  Switching Characteristics, VCCA= 2.5V ± 0.2V
    10. 6.10 Switching Characteristics, VCCA= 3.3V ± 0.3V
    11. 6.11 Operating Characteristics
    12. 6.12 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fully Configurable Dual-Rail Design
      2. 8.3.2 Supports High-Speed Translation
      3. 8.3.3 Partial-Power-Down Mode Operation
      4. 8.3.4 Active Bus-Hold Circuitry
      5. 8.3.5 VCC Isolation
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Unidirectional Logic Level-Shifting Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Bidirectional Logic Level-Shifting Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Enable Times
        3. 9.2.2.3 Application Curve
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Revision History

Changes from Revision E (March 2016) to Revision F (March 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated DBV and DCK thermal information.Go

Changes from Revision D (January 2008) to Revision E (March 2016)

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go