SCES131J March   1998  – April 2024 SN74LV126A

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCC = 2.5V ±0.2V
    7. 5.7  Switching Characteristics, VCC = 3.3V ±0.3V
    8. 5.8  Switching Characteristics, VCC = 5V ±0.5V
    9. 5.9  Noise Characteristics
    10. 5.10 Operating Characteristics
    11. 5.11 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • DB|14
  • DGV|14
  • PW|14
  • NS|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Noise Characteristics

VCC = 3.3V, CL = 50pF, TA = 25°C (see (1))
PARAMETERMINTYPMAXUNIT
VOL(P)Quiet output, maximum dynamic VOL0.30.8V
VOL(V)Quiet output, minimum dynamic VOL–0.2–0.8
VOH(V)Quiet output, minimum dynamic VOH3.1
VIH(D)High-level dynamic input voltage2.31
VIL(D)Low-level dynamic input voltage0.97
Characteristics are for surface-mount packages only.