SCES221S April   1999  – November 2016 SN74LVC1G80

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: TA = -40°C to +85°C
    7. 6.7  Timing Requirements: TA = -40°C to +125°C
    8. 6.8  Switching Characteristics: TA = -40°C to +85°C, CL = 15 pF
    9. 6.9  Switching Characteristics: TA = -40°C to +85°C, CL = 30 pF or 50 pF
    10. 6.10 Switching Characteristics: TA = -40°C to +125°C, CL = 30 pF or 50 pF
    11. 6.11 Operating Characteristics
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
  • DCK|5
  • YZP|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from R Revision (December 2013) to S Revision

  • Added Applications section, Device Information table, ESD Ratings table, Thermal Information table, Typical Characteristics section, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
  • Added max junction temperature to the Recommended Operating Conditions table Go
  • Added operating free-air temperature for YZP package to the Recommended Operating Conditions table Go
  • Changed RθJA value for DBV package from: 206°C/W to: 243.4°C/WGo
  • Changed RθJA value for DCK package from: 252°C/W to: 278.9°C/WGo
  • Changed RθJA value for YZP package from: 132°C/W to: 136.9°C/WGo

Changes from Q Revision (January 2007) to R Revision

  • Updated document to new TI data sheet format.Go
  • Removed Ordering Information table.Go
  • Updated Ioff in Features.Go
  • Updated operating temperature range.Go
  • Added ESD warning Go