SCES584C june   2005  – december 2022 SN74LVC8T245

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information DB, DBQ and DGV
    5. 6.5  Thermal Information PW and RHL
    6. 6.6  Electrical Characteristics
    7. 6.7  Switching Characteristics, VCCA = 1.8 V ± 0.15 V
    8. 6.8  Switching Characteristics, VCCA = 2.5 V ± 0.2 V
    9. 6.9  Switching Characteristics, VCCA = 3.3 V ± 0.3 V
    10. 6.10 Switching Characteristics, VCCA = 5 V ± 0.5 V
    11. 6.11 Operating Characteristics
    12. 6.12 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 1.65-V to 5.5-V Power-Supply Range
      2. 8.3.2 Ioff Supports Partial-Power-Down Mode Operation
      3. 8.3.3 Balanced High-Drive CMOS Push-Pull Outputs
      4. 8.3.4 Vcc Isolation
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

GUID-DE54FD17-F715-496F-BB37-D52BE9255C24-low.gifFigure 5-1 DW, NS, DB, DBQ, DGV, or PW Package, 24-Pin SOIC, SO, SSOP, SSOP, TVSOP, or TSSOP (Top View)
GUID-20221130-SS0I-DL38-PRG8-RGNZPT36LPJR-low.svgFigure 5-2 RHL Package, 24-Pin VQFN (Top View)
Table 5-1 Pin Functions
PINTYPE(1)DESCRIPTION
NAMENO.
A13I/OInput/output A1. Referenced to VCCA.
A24I/OInput/output A2. Referenced to VCCA.
A35I/OInput/output A3. Referenced to VCCA.
A46I/OInput/output A4. Referenced to VCCA.
A57I/OInput/output A5. Referenced to VCCA.
A68I/OInput/output A6. Referenced to VCCA.
A79I/OInput/output A7. Referenced to VCCA.
A810I/OInput/output A8. Referenced to VCCA.
B121I/OInput/output B1. Referenced to VCCB.
B220I/OInput/output B2. Referenced to VCCB.
B319I/OInput/output B3. Referenced to VCCB.
B418I/OInput/output B4. Referenced to VCCB.
B517I/OInput/output B5. Referenced to VCCB.
B616I/OInput/output B6. Referenced to VCCB.
B715I/OInput/output B7. Referenced to VCCB.
B814I/OInput/output B8. Referenced to VCCB.
DIR2IDirection-control signal.
GND11, 12, 13GGround
OE22I3-state output-mode enables. Pull OE high to place all outputs in 3-state mode. Referenced to VCCA.
VCCA1PA-port supply voltage. 1.65 V ≤ VCCA ≤ 5.5 V
VCCB23, 24PB-port supply voltage. 1.65 V ≤ VCCB ≤ 5.5 V
Thermal Pad(2)
I = input, O = output, P = power
For the RHL package only