SCDS112E march   2001  – september 2023 SN74TVC3306

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics (AC, VGATE = 3.3 V, Translating Down)
    7. 6.7  Switching Characteristics (AC, VGATE = 2.5 V, Translating Down)
    8. 6.8  Switching Characteristics (AC, VGATE = 3.3 V, Translating Up)
    9. 6.9  Switching Characteristics (AC, VGATE = 2.5 V, Translating Up)
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Voltage Clamping
    4. 8.4 Device Functional Modes
      1. 8.4.1 Voltage Clamping
      2. 8.4.2 Voltage Passing
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Application Operating Conditions
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DCU|8
  • DCT|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision D (December 2014) to Revision E (September 2023)

  • Changed the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed the thermal values to reflect device performanceGo
  • Changed the switching characteristics to reflect device performanceGo

Changes from Revision C (March 2002) to Revision D (December 2014)

  • Added Applications, Device Information table, Pin Functions table, Handling Ratings table, Thermal Information table, Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go
  • Deleted Ordering Information table.Go
  • Changed the RON parameter in the Electrical Characteristics table.Go