SLOS670B November   2010  – December 2016 TAS5727

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  DC Electrical Characteristics
    6. 8.6  AC Electrical Characteristics (BTL, PBTL)
    7. 8.7  PLL Input Parameters and External Filter Components
    8. 8.8  Serial Audio Ports Slave Mode
    9. 8.9  I2C Serial Control Port Operation
    10. 8.10 Reset Timing (RESET)
    11. 8.11 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagrams
    3. 10.3 Feature Description
      1. 10.3.1  Power Supply
      2. 10.3.2  I2C Address Selection and Fault Output
        1. 10.3.2.1 I2C Chip Select
        2. 10.3.2.2 I2C Device Address Change Procedure
        3. 10.3.2.3 Fault Indication
      3. 10.3.3  Device Protection Systems
        1. 10.3.3.1 Overcurrent (OC) Protection With Current Limiting
        2. 10.3.3.2 Overtemperature Protection
        3. 10.3.3.3 Undervoltage Protection (UVP) and Power-On Reset (POR)
      4. 10.3.4  Clock, Auto Detection, and PLL
      5. 10.3.5  PWM Section
      6. 10.3.6  SSTIMER Functionality
      7. 10.3.7  Single-Filter PBTL Mode
      8. 10.3.8  I2C Serial Control Interface
        1. 10.3.8.1 General I2C Operation
        2. 10.3.8.2 Single- and Multiple-Byte Transfers
        3. 10.3.8.3 Single-Byte Write
        4. 10.3.8.4 Multiple-Byte Write
        5. 10.3.8.5 Single-Byte Read
        6. 10.3.8.6 Multiple-Byte Read
      9. 10.3.9  Audio Serial Interface
      10. 10.3.10 Serial Interface Control and Timing
        1. 10.3.10.1 I2S Timing
        2. 10.3.10.2 Left-Justified
        3. 10.3.10.3 Right-Justified
      11. 10.3.11 Dynamic Range Control (DRC)
      12. 10.3.12 PWM Level Meter
    4. 10.4 Device Functional Modes
      1. 10.4.1 Stereo BTL Mode
      2. 10.4.2 Mono PBTL Mode
    5. 10.5 Programming
      1. 10.5.1 26-Bit 3.23 Number Format
    6. 10.6 Register Maps
      1. 10.6.1  Clock Control Register (0x00)
      2. 10.6.2  Device Id Register (0x01)
      3. 10.6.3  Error Status Register (0x02)
      4. 10.6.4  System Control Register 1 (0x03)
      5. 10.6.5  Serial Data Interface Register (0x04)
      6. 10.6.6  System Control Register 2 (0x05)
      7. 10.6.7  Soft Mute Register (0x06)
      8. 10.6.8  Volume Registers (0x07, 0x08, 0x09)
      9. 10.6.9  Volume Configuration Register (0x0E)
      10. 10.6.10 Modulation Limit Register (0x10)
      11. 10.6.11 Interchannel Delay Registers (0x11, 0x12, 0x13, and 0x14)
      12. 10.6.12 PWM Shutdown Group Register (0x19)
      13. 10.6.13 Start/Stop Period Register (0x1A)
      14. 10.6.14 Oscillator Trim Register (0x1B)
      15. 10.6.15 BKND_ERR Register (0x1C)
      16. 10.6.16 Input Multiplexer Register (0x20)
      17. 10.6.17 Channel 4 Source Select Register (0x21)
      18. 10.6.18 PWM Output MUX Register (0x25)
      19. 10.6.19 DRC Control Register (0x46)
      20. 10.6.20 PWM Switching Rate Control Register (0x4F)
      21. 10.6.21 Bank Switch and EQ Control (0x50)
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Applications
      1. 11.2.1 Stereo Stereo Bridge Tied Load Application
        1. 11.2.1.1 Design Requirements
        2. 11.2.1.2 Detailed Design Procedure
          1. 11.2.1.2.1 Component Selection and Hardware Connections
          2. 11.2.1.2.2 I2C Pullup Resistors
          3. 11.2.1.2.3 Digital I/O Connectivity
          4. 11.2.1.2.4 Recommended Start-Up and Shutdown Procedures
            1. 11.2.1.2.4.1 Initialization Sequence
            2. 11.2.1.2.4.2 Normal Operation
            3. 11.2.1.2.4.3 Shutdown Sequence
            4. 11.2.1.2.4.4 Power-Down Sequence
        3. 11.2.1.3 Application Curves
      2. 11.2.2 Mono Parallel Bridge Tied Load Application
        1. 11.2.2.1 Design Requirements
        2. 11.2.2.2 Detailed Design Procedure
        3. 11.2.2.3 Application Curves
  12. 12Power Supply Recommendations
    1. 12.1 DVDD and AVDD Supplies
    2. 12.2 PVDD Power Supply
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Device Support
      1. 14.1.1 Development Support
    2. 14.2 Documentation Support
      1. 14.2.1 Related Documentation
    3. 14.3 Receiving Notification of Documentation Updates
    4. 14.4 Community Resources
    5. 14.5 Trademarks
    6. 14.6 Electrostatic Discharge Caution
    7. 14.7 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14 Device and Documentation Support

14.1 Device Support

14.1.1 Development Support

For development support, see the following:

TAS57xx GDE

14.2 Documentation Support

14.2.1 Related Documentation

For related documentation, see the following:

  • TAS5727 25-W Digital Input Amplifier With EQ and 2-Band DRC, SLOU299
  • TAS5721-TAS5723EVM User's Guide, SLOU346
  • Class-D LC Filter Design, SLOA119

14.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

14.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

14.5 Trademarks

PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

14.6 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

14.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.