SLOS224J
July 1999 – February 2024
THS4031
,
THS4032
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information: THS4031
5.5
Thermal Information: THS4032
5.6
Electrical Characteristics: THS4031, RL = 150 Ω
5.7
Electrical Characteristics: THS4031, RL = 1 kΩ
5.8
Electrical Characteristics: THS4032, RL = 150 Ω
5.9
Electrical Characteristics: THS4032, RL = 1 kΩ
5.10
Typical Characteristics: THS4031
5.11
Typical Characteristics: THS4032
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagrams
6.3
Feature Description
6.3.1
Offset Nulling
6.4
Device Functional Modes
7
Application and Implementation
7.1
Application Information
7.1.1
Driving a Capacitive Load
7.1.2
Low-pass Filter Configurations
7.2
Typical Application
7.2.1
Design Requirements
7.2.2
Detailed Design Procedure
7.2.2.1
Selection of Multiplexer
7.2.2.2
Signal Source
7.2.2.3
Driving Amplifier
7.2.2.4
Driving Amplifier Bandwidth Restriction
7.2.3
Application Curves
7.3
Power Supply Recommendations
7.4
Layout
7.4.1
Layout Guidelines
7.4.1.1
General PowerPAD™ Design Considerations
7.4.2
Layout Example
8
Device and Documentation Support
8.1
Documentation Support
8.1.1
Related Documentation
8.2
Receiving Notification of Documentation Updates
8.3
Support Resources
8.4
Trademarks
8.5
Electrostatic Discharge Caution
8.6
Glossary
9
Revision History
10
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
D|8
MSOI002K
DGN|8
MPDS046F
Thermal pad, mechanical data (Package|Pins)
DGN|8
PPTD041I
Orderable Information
slos224j_oa
slos224j_pm
8.6
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.