SLVS641B April   2008  – March  2015 TL4242

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Input
      2. 7.3.2 ST Output
        1. 7.3.2.1 Function and Timing Diagram
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input Supply Voltage
      2. 8.1.2 Power Dissipation in TL4242
      3. 8.1.3 Setting the Output Current
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Voltage
        2. 8.2.2.2 Shunt Resistor
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

DRJ Package
8-Pin WSON
(Top View)
TL4242 pinout_drj8_lvs641.gif

Pin Functions

PIN I/O DESCRIPTION
NO. NAME
1 PWM I Pulse-width modulation input. If not used, connect to I.
2 ST O Status output. Open-collector output. Connect to an external pullup resistor (RPULLUP ≥ 4.7 kΩ).
3 GND — Ground
4 REF I Reference input. Connect to a shunt resistor.
5 D I Status delay. To set status reaction delay, connect to GND with a capacitor. If no delay is needed, leave open.
6 Q O Output
7 NC — No internal connection
8 I I Input. Connect directly to GND as close as possible to the device with a 100-nF ceramic capacitor.
— Thermal Pad — The thermal pad must be soldered directly to the PCB. It may be connected to ground or left floating.