SLDS162B March   2009  – December 2015 TLC59108F

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power-On Reset
      2. 8.3.2 External Reset
      3. 8.3.3 Software ResetFixed address typo in the Software Reset Section
      4. 8.3.4 Individual Brightness Control With Group Dimming or Blinking
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
      1. 8.5.1 Device Address
      2. 8.5.2 Regular I2C Bus Slave Address
      3. 8.5.3 LED All Call I2C Bus Address
      4. 8.5.4 LED Sub Call I2C Bus Address
      5. 8.5.5 Software Reset I2C Bus Address
      6. 8.5.6 Characteristics of the I2C Bus
        1. 8.5.6.1 Bit Transfer
        2. 8.5.6.2 Start and Stop Conditions
      7. 8.5.7 System Configuration
      8. 8.5.8 Acknowledge
    6. 8.6 Register Maps
      1. 8.6.1 Control Register
      2. 8.6.2 Mode Register 1 (MODE1)
      3. 8.6.3 Mode Register 2 (MODE2)
      4. 8.6.4 Individual Brightness Control Registers (PWM0-PWM7)
      5. 8.6.5 Group Duty Cycle Control Register (GRPPWM)
      6. 8.6.6 Group Frequency Register (GRPFREQ)
      7. 8.6.7 LED Driver Output State Registers (LEDOUT0, LEDOUT1)
      8. 8.6.8 I2C Bus Sub-Address Registers 1 to 3 (SUBADR1-SUBADR3)
      9. 8.6.9 LED All Call I2C Bus Address Register (ALLCALLADR)
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Setting LED Current
      2. 9.1.2 PWM Brightness Dimming
      3. 9.1.3 TLC59108 and TLC59108F DifferencesTLC59108 and TLC59108F Differences section.
      4. 9.1.4 Connecting Multiple Devices
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Layout

11.1 Layout Guidelines

The I2C signals (SDA / SCL) should be kept away from potential noise sources.

The traces carrying power through the LEDS should be wide enough to handle the necessary current.

All LED current passes through the device and into the ground node. There must be a strong connection between the device ground and the circuit board ground. For the RGY package, the thermal pad should be connected to ground to help dissipate heat.

11.2 Layout Example

TLC59108F TLC59108F_RGY.gif Figure 25. RGY Layout Example
TLC59108F TLC59108F_PW.gif Figure 26. PW Layout Example