SBVS129A May   2009  – July 2018 TLC5952

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Circuit (Multiple Daisy-Chained TLC5952s)
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Pin Equivalent Input and Output Schematic Diagrams
    2. 7.2 Test Circuits
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Maximum Constant-Sink-Current Value
      2. 8.3.2 Global Brightness Control (BC) Function: Sink-Current Control
      3. 8.3.3 Constant-Current Output On-Off Control
    4. 8.4 Device Functional Modes
      1. 8.4.1 LOD, LSD, and TEF Operation
      2. 8.4.2 Register and Data Latch Configuration
        1. 8.4.2.1 Output On-Off Data Latch
        2. 8.4.2.2 Control-Data Latch
        3. 8.4.2.3 Status Information Data (SID)
        4. 8.4.2.4 LED-Open Detection (LOD), LED-Short Detection (LSD), And Thermal Error Flag (TEF)
        5. 8.4.2.5 Thermal Shutdown (TSD)
        6. 8.4.2.6 Noise Reduction
  9. 9 Power Supply Recommendations
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Community Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TLC5952 UNIT
DAP (TSSOP)
32 PINS
RθJA Junction-to-ambient thermal resistance 28.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 20.6 °C/W
RθJB Junction-to-board thermal resistance 10.7 °C/W
ψJT Junction-to-top characterization parameter 0.3 °C/W
ψJB Junction-to-board characterization parameter 10.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.6 °C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.