SBVS424B December   2023  – May 2024 TLV773

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Dropout Voltage
      2. 6.3.2 Active Discharge
      3. 6.3.3 Foldback Current Limit
      4. 6.3.4 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
      2. 7.1.2 Input and Output Capacitor Requirements
    2. 7.2 Typical Application
      1. 7.2.1 Application
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
      4. 7.2.4 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
  • DQN|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.7 Typical Characteristics

at operating temperature TJ = 25°C, VIN = VOUT(NOM) + 0.5V, IOUT = 1mA, VEN = VIN, and CIN = COUT = 1μF (unless otherwise noted)

TLV773 Line Regulation vs VIN
 
Figure 5-1 Line Regulation vs VIN
TLV773 Output Voltage Accuracy vs VIN
 
Figure 5-3 Output Voltage Accuracy vs VIN
TLV773 Dropout Voltage vs IOUT
DBV package
Figure 5-5 Dropout Voltage vs IOUT
TLV773 Ground Current vs IOUT
 
Figure 5-7 Ground Current vs IOUT
TLV773 Current Limit
 
Figure 5-9 Current Limit
TLV773 Load Transient
VIN = VOUT(nom) + 1.0V, IOUT = 1mA to 300mA,
tRISING = 10µs
Figure 5-11 Load Transient
TLV773 Line Transient
VIN = VOUT + 0.3V to VOUT +1.3V
Figure 5-13 Line Transient
TLV773 Start-Up
 
Figure 5-15 Start-Up
TLV773 Load Regulation vs IOUT
DBV package
Figure 5-2 Load Regulation vs IOUT
TLV773 Output Voltage Accuracy vs IOUT
DBV package
Figure 5-4 Output Voltage Accuracy vs IOUT
TLV773 Quiescent Current vs VIN
 
Figure 5-6 Quiescent Current vs VIN
TLV773 Shutdown Current vs VIN
VEN = 0V
Figure 5-8 Shutdown Current vs VIN
TLV773 Enable Logic Threshold vs Temperature
 
Figure 5-10 Enable Logic Threshold vs Temperature
TLV773 Load Transient
VIN = VOUT(nom) + 1.0V, IOUT = 300mA to 1mA,
tFALLING = 10µs
Figure 5-12 Load Transient
TLV773 PSRR vs Frequency
VIN = VOUT(nom) + 1.0V
Figure 5-14 PSRR vs Frequency
TLV773 Noise
VIN = 4.3V, VOUT(nom) = 3.3V
Figure 5-16 Noise