Place input and output capacitors as close to the
device as possible.
Use copper planes for device connections to
optimize thermal performance.
Place thermal vias around the device to
distribute the heat.
Do not place a thermal via directly beneath the
thermal pad of the DQN package. A via wicks solder
or solder paste away from the thermal pad joint
during the soldering process. Thus, leading to a
compromised solder joint on the thermal pad.