SBOS685C April   2014  – July 2015 TMP007

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Spectral Responsivity
      2. 7.3.2 Field of View and Angular Response
      3. 7.3.3 Thermopile Principles and Operation
      4. 7.3.4 Object Temperature Calculation
      5. 7.3.5 Calibration
      6. 7.3.6 Sensor Voltage Format
      7. 7.3.7 Temperature Format
      8. 7.3.8 Serial Interface
        1. 7.3.8.1  Bus Overview
        2. 7.3.8.2  Serial Bus Address
        3. 7.3.8.3  Writing and Reading Operations
        4. 7.3.8.4  Slave Mode Operations
          1. 7.3.8.4.1 Slave Receiver Mode
          2. 7.3.8.4.2 Slave Transmitter Mode:
        5. 7.3.8.5  SMBus Alert Function
        6. 7.3.8.6  General Call
        7. 7.3.8.7  High-Speed (Hs) Mode
        8. 7.3.8.8  Timeout Function
        9. 7.3.8.9  Two-Wire Timing
        10. 7.3.8.10 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Temperature Transient Correction
      2. 7.4.2 Alert Modes: Interupt (INT) and Comparator (COMP)
        1. 7.4.2.1 INT Mode (INT/COMP = 0)
        2. 7.4.2.2 COMP Mode (INT/COMP = 1)
      3. 7.4.3 Nonvolatile Memory Description
        1. 7.4.3.1 Programming the Nonvolatile Memory
        2. 7.4.3.2 Memory Store and Register Load From Memory
    5. 7.5 Register Maps
      1. 7.5.1  Sensor Voltage Result Register (address = 00h) [reset = 0000h]
      2. 7.5.2  TDIE Local Temperature Result Register (address = 01h) [reset = 0000h]
      3. 7.5.3  Configuration Register (address = 02h) [reset = 1440h]
      4. 7.5.4  TOBJ Object Temperature Result Register (address = 03h) [reset = 0000h]
      5. 7.5.5  Status Register (address = 04h) [reset = 0000h]
      6. 7.5.6  Status Mask and Enable Register (address = 05h) [reset = 0000h]
      7. 7.5.7  TOBJ Object Temperature High-Limit Register (address = 06h) [reset = 7FC0h]
      8. 7.5.8  TOBJ Object Temperature Low-Limit Register (address = 07h) [reset = 8000h]
      9. 7.5.9  TDIE Local Temperature High-Limit Register (address = 08h) [reset = 7FC0h]
      10. 7.5.10 TDIE Local Temperature Low-Limit Register (address = 09h) [reset = 8000h]
      11. 7.5.11 Coefficient Registers
        1. 7.5.11.1 S0 Coefficient Register (address = 0Ah) [reset = 260Eh]
        2. 7.5.11.2 A1 Coefficient Register (address = 0Bh) [reset = 0106h]
        3. 7.5.11.3 A2 Coefficient Register (address = 0Ch) [reset = FF9Bh]
        4. 7.5.11.4 B0 Coefficient Register (address = 0Dh) [reset = FF3Ah]
        5. 7.5.11.5 B1 Coefficient Register (address = 0Eh) [reset = FF71h]
        6. 7.5.11.6 B2 Coefficient Register (address = 0Fh) [reset = 0553h]
        7. 7.5.11.7 C2 Coefficient Register (address = 10h) [reset = 0000h]
        8. 7.5.11.8 TC0 Coefficient Register (address = 11h) [reset = 0034h]
        9. 7.5.11.9 TC1 Coefficient Register (address = 12h) [reset = 0000h]
      12. 7.5.12 Manufacturer ID Register (address = 1Eh) [reset = 5449h]
      13. 7.5.13 Device ID Register (address = 1Fh) [reset = 0078h]
      14. 7.5.14 Memory Access Register (address = 2Ah) [reset = 0000h]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Wide-Range Calibration Example: TOBJ = 0°C to 60°C, Common Versus Unit Calibration
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Wide-Range Calibration
          2. 8.2.1.2.2 Verifying the Calibration
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Narrow-Range Calibration Example: TOBJ = 33°C to 41°C, Unit vs Common Calibration
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Narrow-Range Calibration
          2. 8.2.2.2.2 Verifying the Calibration
        3. 8.2.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Use of NEP, NETD, and Responsivity in Estimating System Performance
  9. 9 Power-Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

YZF Package
8-Pin DSBGA
Top View
TMP007 po_sbos518.gif

Pin Functions

PIN DESCRIPTION
NAME NO.
ADR0 C1 Input address 0 selection pin
ADR1 B1 Input address 1 selection pin
AGND A2 Analog ground
ALERT C2 Alert output pin; active low, open-drain. Requires a pull-up resistor to (1.6 V to 5.5 V) supply
DGND A1 Digital ground
SCL B3 Input clock pin
SDA C3 Input/output data pin; open-drain; requires pull-up resistor to (1.6 V to 5.5 V) supply
V+ A3 Supply voltage (2.5 V to 5.5 V)