SNIS233 February   2024 TMP110

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Related Products
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Decoding Temperature Data
      3. 7.3.3 Temperature Limits and Alert
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous-Conversion Mode
      2. 7.4.2 One-Shot Mode
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
      2. 7.5.2 Bus Overview
      3. 7.5.3 Device Address
      4. 7.5.4 Bus Transactions
        1. 7.5.4.1 Writes
        2. 7.5.4.2 Reads
        3. 7.5.4.3 General Call Reset Function
        4. 7.5.4.4 SMBus Alert Response
        5. 7.5.4.5 Time-Out Function
        6. 7.5.4.6 Coexist on I3C Mixed Bus
  9. 8 Register Map
    1. 8.1 Temp_Result Register (address = 00h) [reset = xxxxh]
    2. 8.2 Configuration Register (address = 01h) [reset = 60A0h]
    3. 8.3 TLow_Limit Register (address = 02h) [reset = 4B00h]
    4. 8.4 THigh_Limit Register (address = 03h) [reset = 5000h]
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Separate I2C Pullup and Supply Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
    3. 9.3 Equal I2C Pullup and Supply Application
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3 TLow_Limit Register (address = 02h) [reset = 4B00h]

This register is used to configure the low temperature alert limit of the TMP110. The limit is formatted in a 12-bit or 13-bit two's complement format with a LSB equal to 62.5 m°C depending on the Extended_Mode bit setting in the configuration register. The default value on start-up is 4B00h or 75 °C in normal mode format.

Note: If the temperature register format is changed, the low limit register value must be updated accordingly.

Return to Register Map.

Table 8-9 TLow_Limit Register (Normal Mode)
15 14 13 12 11 10 9 8
TLow_Limit[11:4]
R/W-4Bh
7 6 5 4 3 2 1 0
TLow_Limit[3:0] Reserved
R/W-0h R-0000b
Table 8-10 TLow_Limit Register (Extended Mode)
15 14 13 12 11 10 9 8
TLow_Limit[12:5]
R/W-4Bh
7 6 5 4 3 2 1 0
TLow_Limit[4:0] Reserved
R/W-00h R-000b
Table 8-11 TLow_Limit Register Field Description (Normal Mode)
Bit Field Type Reset Description
15:4 TLow_Limit[11:0] R/W 4B0h 12-bit temperature low limit setting.
Temperature low limit is represented by a 12-bit, two's complement word with an LSB equal to 62.5 m°C when Extended_Mode bit is 0b. The default setting for this is 75°C.
3:0 Reserved R 0000b Reserved
Table 8-12 TLow_Limit Register Field Description (Extended Mode)
Bit Field Type Reset Description
15:3 TLow_Limit[12:0] R/W 4B00h 13-bit temperature low limit setting.
Temperature low limit is represented by a 13-bit, two's complement word with an LSB equal to 62.5 m°C when Extended_Mode bit is 1b.
2:0 Reserved R 000b Reserved