SBOS466B December   2009  – December 2018 TMP20

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Block Diagram
    2.     Device Quiescent Current Over Temperature
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Transfer Function
        1. 7.3.1.1 Example 1
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Drive and Capacitive Loads
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 TINA-TI (Free Download Software)
        1. 11.1.1.1 Using TINA-TI SPICE-Based Analog Simulation Program with the TMP20
      2. 11.1.2 Development Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

The substrate on the TMP20AIDCK package is directly connected through conductive epoxy to the flag that connects pin 2 on the lead frame. Consequently, pin 2 is the best lead for a conductive thermal connection to the TMP20 die. The optimal electrical connection for this pin is ground (GND).

CAUTION

Do not attempt to connect pin 2 (DCK package) to any electrical potential other than ground.

If it is not possible to connect pin 2 to ground, it is possible to electrically isolate this pin (that is, leave it floating). Take care when electrically isolating this pin because any noise or electromagnetic interference or radio frequency interference (EMI or RFI) spikes that couple in through this pin can cause erroneous temperature results.

shows a proper layout of the TMP20 with correct electrical and thermal connections to pin 2.