SNIS210G April   2019  – November 2023 TMP61-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 TMP61-Q1 R-T table
      2. 7.3.2 Linear Resistance Curve
      3. 7.3.3 Positive Temperature Coefficient (PTC)
      4. 7.3.4 Built-In Fail Safe
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 AEC-Q200 Qualifications
    3. 8.3 Typical Application
      1. 8.3.1 Thermistor Biasing Circuits
        1. 8.3.1.1 Design Requirements
        2. 8.3.1.2 Detailed Design Procedure
          1. 8.3.1.2.1 Thermal Protection With Comparator
          2. 8.3.1.2.2 Thermal Foldback
        3. 8.3.1.3 Application Curve
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Glossary
    6. 9.6 Electrostatic Discharge Caution
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision F (February 2021) to Revision G (November 2023)

  • Changed table title from Device Information to Package Information Go
  • Added notes to pinout diagramsGo
  • Moved the Power Supply Recommendations and Layout sections to the Application and Implementation sectionGo

Changes from Revision E (March 2020) to Revision F (February 2021)

  • Added AEC-Q200 Tested to Features.Go
  • Added Functional Safety-Capable to FeaturesGo
  • Changed DYA to Grade-0Go
  • Updated Device Comparison TableGo
  • Increased Maximum Storage Temperature in Absolute Maximum Ratings Table to 175°CGo
  • Changed Max Ambient Temperature from 125 °C to 150 °C for DYA package in Recommended Operating Conditions Go
  • Changed DYA package to Grade-0 150 C rating in Recommended Operating Conditions Go
  • Added HTOL and HTSL notes to Recommended Operating Conditions Go
  • Added 1000 hour Long Term Drift specification for DYA packageGo
  • Updated Typical Characteristics curvesGo
  • Added QEC-Q200 Qualification feature sectionGo

Changes from Revision D (February 2020) to Revision E (March 2020)

  • Removed preview notice from the SOT-5X3 packageGo
  • Updated Description sectionGo
  • Changed minimum Junction Temperature from –40°C to –65°C in Absolute Maximum Ratings tableGo
  • Changed Max Junction Temperature from 150°C to 155°C in Recommended Operating Conditions Go

Changes from Revision C (January 2020) to Revision D (February 2020)

  • Updated Features listGo
  • Updated Applications listGo
  • Updated DescriptionGo
  • Updated Device Comparison Table ELPG package TA support from 150°C to 170 °CGo
  • Added DYA package to Device Comparison TableGo
  • Added description for Junction temperature in Absolute Maximum Ratings Go
  • Added TJMAX spec for Automotive Grade 0 to Absolute Maximum Ratings Go
  • Added ISNS spec for TA = 150 °C to 170 °C to Recommended Operating Conditions Go
  • Changed TA description to Automotive Grade 1 in Recommended Operating Conditions Go
  • Changed TA description to Automotive Grade 0 in Recommended Operating Conditions   Go
  • Changed ambient temperature support for  Automotive Grade 0 in from 150 °C to 170 °CGo
  • Added 'Resistance Tolerance' Spec for TA = 150°C to 170°CGo
  • Added 'Long Term Drift ' for DYA packageGo
  • Changed min spec 'Long Term Drift' for RH = 86 % from 0.1 % to -1 %Go
  • Added typical spec 'Long Term Drift' fpr RH = 86 %Go
  • Changed max spec 'Long Term Drift' for RH = 86 % from 0.8 % to 1 %Go
  • Changed min spec 'Long Term Drift' for DEC package from 0.1 % to -1 %Go
  • Added typical spec 'Long Term Drift' for DEC packageGo
  • Changed max spec 'Long Term Drift' for RH = 86 % from 1 % to 1.8 %Go
  • Changed min spec  'Long Term Drift ' for LPG package from 0.1 % to -0.5 %Go
  • Changed min spec  'Long Term Drift ' for LPG package from 0.1 % to -0.5 %Go
  • Added typical spec 'Long Term  for Drift' LPG packageGo
  • Changed max spec 'Long Term Drift' for RH = 86 % from 1.1 % to 1.4 %Go
  • Added  Added 'Long Term Drift' Spec for ELPG packageGo
  • Added Automotive Grade 0 typical characteristic curvesGo
  • Updated Overview sectionGo
  • Added TMP61-Q1 R-T Table sectionGo
  • Updated Feature Description sectionGo
  • Removed Transfer TablesGo
  • Added Built-In Fail Safe sectionGo
  • Updated Application and implementation section to match TI data sheet standardsGo
  • Added link to Thermistor Design toolGo
  • Removed Thermal Compensation sectionGo

Changes from Revision B (September 2019) to Revision C (January 2020)

  • Added DYA package in PREVIEW statusGo
  • Standardized pinout diagramsGo
  • Clarified Equation 1 Go

Changes from Revision A (June 2019) to Revision B (September 2019)

  • Changed data sheet status from Production Mixed to Production DataGo
  • Added preview SOT-5X3 package Go
  • Removed 'Functional, Unspecified Performance' rowsGo
  • Removed 'Functional, Unspecified Performance' rowsGo
  • Added 'Long Term Drift' spec for LPG packageGo
  • Added Thermal Response Time graphs for the LPG packageGo
  • Added transfer tables for the LPG packageGo

Changes from Revision * (April 2019) to Revision A (June 2019)

  • Changed device status from Advanced Information to Production Data Go