SCDS367E august   2017  – june 2023 TMUX136

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dynamic Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Low Power Mode
    4. 8.4 Device Functional Modes
      1. 8.4.1 High Impedance Mode
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RSE|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision D (August 2020) to Revision E (June 2023)

  • Added the I3C (SenseWire) application information to the data sheetGo
  • Added the Package Information tableGo

Changes from Revision C (July 2018) to Revision D (August 2020)

  • Added new specification limits to support added temperature range TA = -40°C to +125°C Go

Changes from Revision B (November 2017) to Revision C (July 2018)

  • Changed pin 6 To: EN, pin 7 To: COM2, and pin 8 To: COM1 in Figure 9-19 Go

Changes from Revision A (October 2017) to Revision B (November 2017)

  • Changed Pin 7 From: COM1 To: COM2Go
  • Changed Pin 8 From: COM2 To: COM1Go
  • Deleted SPRAAR7D link From Related Documentation. Go

Changes from Revision * (August 2017) to Revision A (October 2017)

  • Changed the HBM value From: ±3500 To: ±5000 in the ESD Ratings tableGo
  • Changed D+/- To: COM, USB+/- To: A, and MHL+/- To: B in fig 5 (don't show in history per LBE and Cheri Davis (CMS)Go