SCDS391C October   2018  – December 2019 TMUX1574

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Application Example
      2.      Block Diagram
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dynamic Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
      1. 6.8.1 Eye Diagrams
  7. Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  Off-Leakage Current
    3. 7.3  On-Leakage Current
    4. 7.4  IPOFF Leakage Current
    5. 7.5  Transition Time
    6. 7.6  tON (EN) and tOFF (EN) Time
    7. 7.7  tON (VDD) and tOFF (VDD) Time
    8. 7.8  Break-Before-Make Delay
    9. 7.9  Propagation Delay
    10. 7.10 Skew
    11. 7.11 Charge Injection
    12. 7.12 Capacitance
    13. 7.13 Off Isolation
    14. 7.14 Channel-to-Channel Crosstalk
    15. 7.15 Bandwidth
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Beyond Supply Operation
      3. 8.3.3 1.8 V Logic Compatible Inputs
      4. 8.3.4 Powered-off Protection
      5. 8.3.5 Fail-Safe Logic
      6. 8.3.6 Low Capacitance
      7. 8.3.7 Integrated Pull-Down Resistors
    4. 8.4 Device Functional Modes
    5. 8.5 Truth Tables
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Application

Common applications that require the features of the TMUX1574 include multiplexing various protocols from a possessor or MCU such as SPI, JTAG, or standard GPIO signals. The TMUX1574 provides superior isolation performance when the device is powered. The added benefit of powered-off protection allows a system to minimize complexity by eliminating the need for power sequencing in hot-swap and live insertion applications. The example shown in Figure 42 illustrates the use of the TMUX1574 to multiplex an SPI bus to multiple flash memory devices.

TMUX1574 SPI_Flash_Muxing.gifFigure 42. Multiplexing Flash Memory