SCDS450A November   2022  – March 2023 TMUX6201 , TMUX6202

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Thermal Information
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Source or Drain Continuous Current
    6. 7.6  ±15 V Dual Supply: Electrical Characteristics 
    7. 7.7  ±15 V Dual Supply: Switching Characteristics 
    8. 7.8  36 V Single Supply: Electrical Characteristics 
    9. 7.9  36 V Single Supply: Switching Characteristics 
    10. 7.10 12 V Single Supply: Electrical Characteristics 
    11. 7.11 12 V Single Supply: Switching Characteristics 
    12. 7.12 ±5 V Dual Supply: Electrical Characteristics 
    13. 7.13 ±5 V Dual Supply: Switching Characteristics 
    14. 7.14 Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1  On-Resistance
    2. 8.2  Off-Leakage Current
    3. 8.3  On-Leakage Current
    4. 8.4  tON and tOFF Time
    5. 8.5  tON (VDD) Time
    6. 8.6  Propagation Delay
    7. 8.7  Charge Injection
    8. 8.8  Off Isolation
    9. 8.9  Bandwidth
    10. 8.10 THD + Noise
    11. 8.11 Power Supply Rejection Ratio (PSRR)
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Bidirectional Operation
      2. 9.3.2 Rail-to-Rail Operation
      3. 9.3.3 1.8 V Logic Compatible Inputs
      4. 9.3.4 Integrated Pull-Down Resistor on Logic Pins
      5. 9.3.5 Fail-Safe Logic
      6. 9.3.6 Latch-Up Immune
      7. 9.3.7 Ultra-Low Charge Injection
    4. 9.4 Device Functional Modes
    5. 9.5 Truth Tables
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 TIA Feedback Gain Switch
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Ultra-Low Charge Injection

Figure 9-1 shows how the TMUX620x devices have a transmission gate topology. Any mismatch in the stray capacitance associated with the NMOS and PMOS causes an output level change whenever the switch is opened or closed.

GUID-9E8A8903-7B54-42B6-9E7C-0BB739A61CF0-low.gif Figure 9-1 Transmission Gate Topology

The TMUX620x contains specialized architecture to reduce charge injection on the Drain (Dx). To further reduce charge injection in a sensitive application, a compensation capacitor (Cp) can be added on the Source (S). This will push excess charge from the switch transition into the compensation capacitor on the Source (S) instead of the Drain (D). As a general rule, Cp should be 20x larger than the equivalent load capacitance on the Drain (D). Figure 9-2 shows charge injection variation with different compensation capacitors on the Source side. This plot was captured on the TMUX6219 as part of the TMUX62xx family with a 100 pF load capacitance.

GUID-EFBF1B65-725F-4540-B80A-F7167C426E6D-low.svg Figure 9-2 Charge Injection Compensation