SLASF92 july   2023 TMUXHS221LV

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  High-Speed Performance Parameters
    7. 6.7  Switching Characteristics
    8. 6.8  Typical Characteristics – S-Parameters
    9. 6.9  Typical Characteristics – RON
    10. 6.10 Typical Characteristics – Eye Diagrams
    11.     18
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Enable and Power Savings
      2. 7.3.2 Data Line Biasing
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Routing Debug Signals to USB Port
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Systems Examples
        1. 8.2.2.1 PCIe Clock Muxing
        2. 8.2.2.2 USB-C SBU Muxing
        3. 8.2.2.3 Switching USB Port
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC-ABSMAX Supply voltage –0.5 2.4 V
VI/O-ABSMAX Voltage Data pins –0.5 5.5 V
VIN-ABSMAX Voltage Control pins –0.5 4 V
II/O-ABSMAX ON-state switch current Data pins 100 mA
TJ-ABSMAX Junction temperature –40 125 °C
TSTG Storage temperature –65 150 °C
(1) Operation outside the Absolute Maximum Rating may cause permanent device damage. Absolute Maximum Rating do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Condition. If used outside the Recommended Operating Condition but within the Absolute Maximum Rating, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.