SLOS650F August   2009  – June 2016 TPA3113D2

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics, VCC = 24 V
    6. 6.6 DC Electrical Characteristics, VCC = 12 V
    7. 6.7 AC Electrical Characteristics, VCC = 24 V
    8. 6.8 AC Electrical Characteristics, VCC = 12 V
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Gain Setting Through GAIN0 and GAIN1 Inputs
      2. 7.3.2 SD Operation
      3. 7.3.3 PLIMIT
      4. 7.3.4 GVDD Supply
      5. 7.3.5 DC Detect
      6. 7.3.6 PBTL Select
      7. 7.3.7 Short-Circuit Protection and Automatic Recovery Feature
      8. 7.3.8 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 TPA3113D2 Modulation Scheme
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Stereo Class-D Amplifier With BTL Output
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Ferrite Bead Filter Considerations
          2. 8.2.1.2.2 Efficiency: LC Filter Required With the Traditional Class-D Modulation Scheme
          3. 8.2.1.2.3 When to Use an Output Filter for EMI Suppression
          4. 8.2.1.2.4 Input Resistance
          5. 8.2.1.2.5 Input Capacitor, CI
          6. 8.2.1.2.6 BSN and BSP Capacitors
          7. 8.2.1.2.7 Differential Inputs
          8. 8.2.1.2.8 Using LOW-ESR Capacitors
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Stereo Class-D Amplifier With BTL Output
      3. 8.2.3 Stereo Class-D Amplifier With PBTL Output
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Decoupling, CS
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Material Recommendation
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.