SLIS110C April   2003  – March 2015 TPIC8101

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Functional Terminal Description
        1. 8.3.1.1  Supply Voltage (VDD)
        2. 8.3.1.2  Ground (GND)
        3. 8.3.1.3  Reference Supply (Vref)
        4. 8.3.1.4  Buffered Integrator Output (OUT)
        5. 8.3.1.5  Integration/Hold Mode Selection (INT/HOLD)
        6. 8.3.1.6  Chip Select for SPI (CS)
        7. 8.3.1.7  Oscillator Input (XIN)
        8. 8.3.1.8  Oscillator Output (XOUT)
        9. 8.3.1.9  Data Output (SDO)
        10. 8.3.1.10 Data Input (SDI)
        11. 8.3.1.11 Serial Clock (SCLK)
        12. 8.3.1.12 Test (TEST)
        13. 8.3.1.13 Feedback Output for Amplifiers (CH1FB and CH2FB)
        14. 8.3.1.14 Input Amplifiers (CH1P, CH1N, CH2P, and CH2N)
      2. 8.3.2 Timing Information
    4. 8.4 Device Functional Modes
      1. 8.4.1 System Transfer Equation
      2. 8.4.2 Programming in Normal Mode (TEST = 1)
      3. 8.4.3 Default SPI Mode
      4. 8.4.4 Advanced SPI Mode
      5. 8.4.5 Digital Data Output from the TPIC8101
    5. 8.5 Programming
      1. 8.5.1 Programming Examples
      2. 8.5.2 Programming in TEST Mode (TEST = 0)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (December 2014) to C Revision

  • Added qualification for automotive applications to FeaturesGo
  • Added the ESD Ratings table with HBM and CDM ratings Go

Changes from A Revision (May 2005) to B Revision

  • Added Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go