SLVSGF4B june   2022  – may 2023 TPS1641

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Enable and Shutdown Input (EN/SHDN)
      2. 8.3.2  Overvoltage Protection (OVP)
      3. 8.3.3  Output Slew Rate and Inrush Current Control (dVdt)
      4. 8.3.4  Active Current Limiting (ILIM) With the TPS16412, TPS16413, TPS16416, and TPS16417
      5. 8.3.5  Active Power Limiting (PLIM) With the TPS16410, TPS16411, TPS16414, and TPS16415
        1. 8.3.5.1 Internal Current Limit for the TPS16410 and TPS16411
      6. 8.3.6  Overcurrent Protection (IOCP) and Blanking Time (IDLY or PDLY) for Transient Loads
      7. 8.3.7  Fast-Trip and Short-Circuit Protection
      8. 8.3.8  Analog Load Current Monitor (IMON) on the IOCP Pin
      9. 8.3.9  IN to OUT Short Detection (TPS16410, TPS16411, TPS16412, and TPS16413)
      10. 8.3.10 Thermal Shutdown and Overtemperature Protection
      11. 8.3.11 Fault Response and Indication (FLT)
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application: 15-W Power Limiting for Low Power Circuits (LPCs)
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Setting Overvoltage Setpoints
        2. 9.2.2.2 Setting the Output Overcurrent Setpoint (IOCP)
        3. 9.2.2.3 Setting the Output Power Limit
        4. 9.2.2.4 Monitoring the Output Current
        5. 9.2.2.5 Limiting the Inrush Current and Setting the Output Slew Rate
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Accurate Power or Current Limiting at the Output of DC/DC or Flyback Converter
    4. 9.4 Best Design Practices
    5. 9.5 Power Supply Recommendations
      1. 9.5.1 Transient Protection
    6. 9.6 Layout
      1. 9.6.1 Layout Guidelines
      2. 9.6.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Shutdown and Overtemperature Protection

During power or current limiting, there is a power dissipation [(VIN – VOUT) × IOUT] in the internal FET of the device. Due to this power dissipation, the temperature (TJ) of device increases. When the device temperature increases above TTSD, it shuts down. After the thermal shutdown, the TPS16411, TPS16413, TPS16415, and TPS16417 remain latched. To reset the latch, toggle EN/SHDN or recycle the Vcc supply. To reset the latch, keep EN/SHDN pin low for duration more than tLow_SHDN.

After thermal shutdown, the TPS16410, TPS16412, TPS16414, and TPS16416 devices wait for temperature to go below [TTSD – TTSD-hyst] and then the device restarts after a delay of tretry.