SLVSEG3E September   2019  – March 2022 TPS25840-Q1 , TPS25842-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Switching Characteristics
    8. 8.8 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1  Buck Regulator
      2. 10.3.2  Enable/UVLO
      3. 10.3.3  Switching Frequency and Synchronization (RT/SYNC)
      4. 10.3.4  Spread-Spectrum Operation
      5. 10.3.5  VCC, VCC_UVLO
      6. 10.3.6  Minimum ON-time, Minimum OFF-time
      7. 10.3.7  Internal Compensation
      8. 10.3.8  Bootstrap Voltage (BOOT)
      9. 10.3.9  RSNS, RSET, RILIMIT and RIMON
      10. 10.3.10 Overcurrent and Short Circuit Protection
        1. 10.3.10.1 Current Limit Setting using RILIMIT
        2. 10.3.10.2 Buck Average Current Limit Design Example
        3. 10.3.10.3 External MOSFET Gate Drivers
        4. 10.3.10.4 Cycle-by-Cycle Buck Current Limit
      11. 10.3.11 Overvoltage, IEC and Short-to-Battery Protection
        1. 10.3.11.1 V BUS and V CSN/OUT Overvoltage Protection
        2. 10.3.11.2 DP_IN and DM_IN Protection
      12. 10.3.12 Cable Compensation
        1. 10.3.12.1 Cable Compensation Design Example
      13. 10.3.13 USB Port Control
      14. 10.3.14 FAULT Response
      15. 10.3.15 USB Specification Overview
      16. 10.3.16 Device Power Pins (IN, CSN/OUT, and PGND)
      17. 10.3.17 Thermal Shutdown
    4. 10.4 Device Functional Modes
      1. 10.4.1 Shutdown Mode
      2. 10.4.2 Active Mode
      3. 10.4.3 Device Truth Table (TT)
      4. 10.4.4 USB Port Operating Modes
        1. 10.4.4.1 Standard Downstream Port (SDP) Mode — USB 2.0, USB 3.0, and USB 3.1
        2. 10.4.4.2 Charging Downstream Port (CDP) Mode
        3. 10.4.4.3 Client Mode
      5. 10.4.5 High-bandwidth Data-line Switches
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1  Output Voltage
        2. 11.2.2.2  Switching Frequency
        3. 11.2.2.3  Inductor Selection
        4. 11.2.2.4  Output Capacitor Selection
        5. 11.2.2.5  Input Capacitor Selection
        6. 11.2.2.6  Bootstrap Capacitor Selection
        7. 11.2.2.7  VCC Capacitor Selection
        8. 11.2.2.8  Enable and Under Voltage Lockout Set-Point
        9. 11.2.2.9  Current Limit Set-Point
        10. 11.2.2.10 Cable Compensation Set-Point
        11. 11.2.2.11 FAULT Resistor Selection
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Ground Plane and Thermal Considerations
    3. 13.3 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Related Links
    3. 14.3 Receiving Notification of Documentation Updates
    4. 14.4 Support Resources
    5. 14.5 Trademarks
    6. 14.6 Electrostatic Discharge Caution
    7. 14.7 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.7 Switching Characteristics

Limits apply over the junction temperature (TJ) range of -40°C to +150°C; VIN = 13.5 V, fSW =400 kHz, CVCC = 2.2 µF, RSNS = 15 mΩ, RIMON = 13 kΩ, RILIMIT= 13 kΩ, RSET= 300 Ω unless otherwise stated. Minimum and maximum limits are specified through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SOFT START
TSS Internal soft-start time The time of internal reference to increase from 0 V to 1.0 V 3 5 7 ms
HICCUP MODE
NOC Number of cycles that LS current limit is tripped to enter Hiccup mode 128 Cycles
TOC Hiccup retry delay time 118 ms
SW (SW PIN)
TON_MIN Minimum turnon-time 105 ns
TON_MAX Maximum turnon-time, HS timeout in dropout 7.5 µs
TOFF_MIN Minimum turnoff time 80 ns
Dmax Maximum switch duty cycle 98 %
TIMING RESISTOR AND INTERNAL CLOCK
fSW_RANGE Switching frequency range using RT mode 300 2300 kHz
fSW Switching frequency RT = 49.9 kΩ 360 400 440 kHz
Switching frequency RT = 8.87 kΩ 1953 2100 2247 kHz
FSSS Frequency span of spread spectrum operation ±6 %
NFET DRIVER
tr VLS_DR rise time VOUT = 5.1 V, NFET = CSD87502Q2, time from LS_GD 10% to 90% 1000 µs
tf VLS_DR fall time VOUT = 5.1 V, NFET = CSD87502Q2, time from LS_GD time 90% to 10% 100 µs
CURRENT LIMIT - EXTERNAL NFET CONNECTED BETWEEN CSN/OUT AND BUS, LS_GD CONNECTED TO FET GATE
tOC_HIC_ON ON-time during hiccup mode 2 ms
tOC_HIC_OFF OFF-time during hiccup mode 263 ms
FAULT DUE TO VBUS OC, VBUS OV, DP OV, DM OV
tDEGLA Asserting deglitch time 5.5 8.2 11.5 ms
tDEGLD De-asserting deglitch time 5.5 8.2 11.5 ms
BUCK_ST
tDEGLA Asserting deglitch time 88 150 220 ms
HIGH-BANDWIDTH ANALOG SWITCH
tpd Analog switch propagation delay 0.14 ns
tSK Analog switch skew between opposite transitions of the same port (tPHL – tPLH) 0.02 ns
tOV_Dn DP_IN and DM_IN overvoltage protection response time 2 µs
tST_DEG_Dn Deglitch time from Vcc > 4V to DP / DM data switch turn on 88 150 220 ms