SLUSAK4D June   2011  – July 2015 TPS53317

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Operation
      2. 7.3.2 PWM Frequency and Adaptive On-Time Control
      3. 7.3.3 Light-Load Power Saving Features
      4. 7.3.4 Power Sequences
        1. 7.3.4.1 Non-Tracking Startup
        2. 7.3.4.2 Tracking Startup
      5. 7.3.5 Protection Features
        1. 7.3.5.1 5-V Undervoltage Protection (UVLO)
        2. 7.3.5.2 Power Good Signals
        3. 7.3.5.3 Output Overvoltage Protection (OVP)
        4. 7.3.5.4 Output Undervoltage Protection (UVP)
        5. 7.3.5.5 Overcurrent Protection
          1. 7.3.5.5.1 Overcurrent Limit
          2. 7.3.5.5.2 Negative OCL
      6. 7.3.6 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Non-Droop Configuration
      2. 7.4.2 Droop Configuration
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 DDR4 SDRAM Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Step 1. Determine Configuration
          2. 8.2.1.2.2 Step 2. Select Inductor
          3. 8.2.1.2.3 Step 3. Determine Output Capacitance
          4. 8.2.1.2.4 Step 4. Input Capacitance
          5. 8.2.1.2.5 Step 5. Compensation Network
          6. 8.2.1.2.6 Peripheral Component Selection
        3. 8.2.1.3 Application Curves
      2. 8.2.2 DDR3 SDRAM Application
        1. 8.2.2.1 Design Requirements
      3. 8.2.3 Non-Tracking Point-of-Load (POL) Application
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (November 2013) to D Revision

  • Added Pin Configuration and Functions section, ESD Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Added "SW (transient 20 ns and E = 5 µJ)" specification in Absolute Maximum Ratings tableGo
  • Added Figure 41Go

Changes from B Revision (MAY 2012) to C Revision

Changes from A Revision (JULY 2011) to B Revision

  • Added Memory Termination bullet in APPLICATIONSGo
  • Added clarity to Go
  • Added updates to Table 1Go

Changes from * Revision (JUNE 2011) to A Revision

  • Changed from "SKIP and Forced CCM" to "SKIP or Forced CCM" in FEATURESGo
  • Changed from "600-kHz and 1-MHz Switching" to "600-kHz or 1-MHz Switching" in FEATURESGo
  • Added clarity to Simplified Application drawingGo
  • Changed from "fSW = 600 kHz" to " fSW = 1 MHz" for tON(min) in EC tableGo