SLVSC13A July   2013  – March 2016

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6  Pin Configuration and Function
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 EasyScale Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Normal Operation
      2. 8.3.2  Boost Converter
      3. 8.3.3  IFBx Pin Unused
      4. 8.3.4  Enable and Start-Up
      5. 8.3.5  Soft Start
      6. 8.3.6  Full-Scale Current Program
      7. 8.3.7  Brightness Control
      8. 8.3.8  Undervoltage Lockout
      9. 8.3.9  Overvoltage Protection
      10. 8.3.10 Overcurrent Protection
      11. 8.3.11 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 One-Wire Digital Interface (Easyscale Interface)
      2. 8.4.2 PWM Control Interface
    5. 8.5 Programming
      1. 8.5.1 EasyScale Programming
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Schottky Diode Selection
        3. 9.2.2.3 Compensation Capacitor Selection
        4. 9.2.2.4 Output Capacitor Selection
      3. 9.2.3 Application Curves
      4. 9.2.4 Additional Application Circuits
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Layout

11.1 Layout Guidelines

As for all switching power supplies, especially those providing high current and using high switching frequencies, layout is an important design step. If layout is not carefully done, the regulator could show instability as well as EMI problems. Therefore, use wide and short traces for high current paths. The input capacitor, C1 in the Figure 14, must be close to the inductor, as well as the VIN and GND pins, in order to reduce the input ripple detected by the device. If possible, choose a higher capacitance value for C1. If the ripple seen at VIN pin is so great that it affects the boost loop stability or internal circuits operation, TI recommends R2 and C3 to filter and decouple the noise. In this case, C3 must be placed as close to the VIN and GND pins as possible.

The SW pin carries high current with fast rising and falling edges. Therefore, the connection between the SW pin to the inductor and Schottky diode must be kept as short and wide as possible. The trace between the Schottky diode and the output capacitor C2 must also be as short and wide as possible. It is beneficial to have the ground of the output capacitor C2 close to the GND pin because there is a large ground return current flowing between them. When laying out signal grounds, TI recommends using short traces separated from power ground traces, and connecting them together at a single point close to the GND pin.

11.2 Layout Example

TPS61162D layout_SLVSC26.gif Figure 24. TPS61162D Layout Example