SLVS893F December   2008  – May 2019 TPS61500

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Circuit
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Switching Frequency
      2. 7.3.2 Soft Start
      3. 7.3.3 Enable and Thermal Shutdown
      4. 7.3.4 Undervoltage Lockout (UVLO)
      5. 7.3.5 Overvoltage Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Dimming Method
      2. 7.4.2 Analog Dimming Method
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Analog Dimming Method
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Programming the Overvoltage Protection
          2. 8.2.1.2.2 Programming the LED Current
          3. 8.2.1.2.3 Implementing Dimming
          4. 8.2.1.2.4 Computing the Maximum Output Current
          5. 8.2.1.2.5 Selecting the Inductor
          6. 8.2.1.2.6 Selecting the Schottky Diode
          7. 8.2.1.2.7 Selecting the Compensation Capacitor and Resistor
          8. 8.2.1.2.8 Selecting the Input and Output Capacitor
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Pure PWM Dimming Method
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Receiving Notification of Documentation Updates
      3. 11.1.3 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.3 Thermal Considerations

As mentioned before, the maximum device junction temperature must be restricted to 125°C under normal operating conditions. This restriction limits the power dissipation of the TPS61500. Calculate the maximum allowable dissipation, PD (maximum), and keep the actual dissipation less than or equal to PD (maximum). The maximum-power-dissipation limit is determined using Equation 8:

Equation 8. TPS61500 eq_pd_lvs893.gif

where

  • TA is the maximum ambient temperature for the application
  • RθJA is the thermal resistance junction-to-ambient given in Thermal Information

The TPS61500 comes in a thermally enhanced TSSOP package. This package includes a thermal pad that improves the thermal capabilities of the package. The RθJA of the TSSOP package greatly depends on the PCB layout.