SLVS667B July   2006  – January 2016 TPS65022

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  VRTC Output and Operation With or Without Backup Battery
      2. 7.3.2  Step-Down Converters, VDCDC1, VDCDC2, and VDCDC3
      3. 7.3.3  Power Save Mode Operation
      4. 7.3.4  Low Ripple Mode
      5. 7.3.5  Soft-Start
      6. 7.3.6  100% Duty Cycle Low Dropout Operation
      7. 7.3.7  Active Discharge When Disabled
      8. 7.3.8  Power Good Monitoring
      9. 7.3.9  Low Dropout Voltage Regulators
      10. 7.3.10 Undervoltage Lockout
      11. 7.3.11 Power-Up Sequencing
      12. 7.3.12 System Reset + Control Signals
        1. 7.3.12.1 DEFLDO1 and DEFLDO2
        2. 7.3.12.2 Interrupt Management and the INT Pin
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
    6. 7.6 Register Maps
      1. 7.6.1 VERSION Register Address: 00h (read only)
      2. 7.6.2 PGOODZ Register Address: 01h (read only)
      3. 7.6.3 MASK Register Address: 02h (read/write) Default Value: C0h
      4. 7.6.4 REG_CTRL Register Address: 03h (read/write) Default Value: FFh
      5. 7.6.5 CON_CTRL Register Address: 04h (read/write) Default Value: B1h
      6. 7.6.6 CON_CTRL2 Register Address: 05h (read/write) Default Value: 40h
      7. 7.6.7 DEFCORE Register Address: 06h (read/write) Default Value: 14h/1Eh
      8. 7.6.8 DEFSLEW Register Address: 07h (read/write) Default Value: 06h
      9. 7.6.9 LDO_CTRL Register Address: 08h (read/write) Default Value: set with DEFLDO1 and DEFLDO2
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input Voltage Connection
      2. 8.1.2 Unused Regulators
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection for the DC-DC Converters
        2. 8.2.2.2 Output Capacitor Selection
        3. 8.2.2.3 Input Capacitor Selection
        4. 8.2.2.4 Output Voltage Selection
        5. 8.2.2.5 VRTC Output
        6. 8.2.2.6 LDO1 and LDO2
        7. 8.2.2.7 TRESPWRON
        8. 8.2.2.8 VCC-Filter
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

8.1 Application Information

8.1.1 Input Voltage Connection

The low power section of the control circuit for the step-down converters DCDC1, DCDC2 and DCDC3 is supplied by the VCC pin while the circuitry with high power such as the power stage is powered from the VINDCDC1, VINDCDC2, and VINDCDC3 pins. For proper operation of the step-down converters, VINDCDC1, VINDCDC2, VNDCDC3, and Vcc need to be tied to the same voltage rail. Step-down converters that are planned to be not used, still need to be powered from their input pin on the same rails than the other step-down converters and VCC.

LDO1 and LDO2 share a supply voltage pin which can be powered from the VCC rails or from a voltage lower than VCC, for example, the output of one of the step-down converters as long as it is operated within the input voltage range of the LDOs. If both LDOs are not used, the VINLDO pin can be tied to GND.

8.1.2 Unused Regulators

If a step-down converter is not used, the input supply voltage pin VINDCDCx must connect to the VCC rail along with supply input of the other step-down converters. TI recommends closing the control loop such that an inductor and output capacitor is added in the same way when operated normally. If one of the LDOs is not used, its output capacitor should be added as well. If both LDOs are not used, the input supply pin and the output pins of the LDOs (VINLDO, VLDO1, VLDO2) should be tied to GND.

8.2 Typical Application

TPS65022 typ_bulv_conf_lvs613.gif Figure 35. Typical Configuration for the Intel® PXA270 Bulverde Processor

8.2.1 Design Requirements

The TPS65022 device has only a few design requirements. Use the following parameters for the design example:

  • 1-μF bypass capacitor on VCC, located as close as possible to the VCC pin to ground
  • VCC, VINDCDC1, VINDCDC2, and VINDCDC3 must be connected to the same voltage supply with minimal voltage difference
  • Input capacitors must be present on the VINDCDC1, VINDCDC2, VINDCDC3, and VIN_LDO supplies if used
  • Output inductor and capacitors must be used on the outputs of the DCDC converters if used
  • Output capacitors must be used on the outputs of the LDOs if used

8.2.2 Detailed Design Procedure

8.2.2.1 Inductor Selection for the DC-DC Converters

Each of the converters in the TPS65022 typically use a 3.3 μH output inductor. Larger or smaller inductor values are used to optimize the performance of the device for specific operation conditions. The selected inductor has to be rated for its DC resistance and saturation current. The DC resistance of the inductance influences directly the efficiency of the converter. Therefore, an inductor with lowest DC resistance should be selected for highest efficiency.

For a fast transient response, a 2.2-μH inductor in combination with a 22-μF output capacitor is recommended.

Equation 4 calculates the maximum inductor current under static load conditions. The saturation current of the inductor should be rated higher than the maximum inductor current as calculated with Equation 4. This is needed because during heavy load transient the inductor current rises above the value calculated under Equation 4.

Equation 4. TPS65022 q4_delta_lvs607.gif
Equation 5. TPS65022 q5_ilmax_lvs607.gif

where

  • ƒ = Switching Frequency (1.5 MHz typical)
  • L = Inductor value
  • ΔIL = Peak-to-peak inductor ripple current
  • IL(max) = Maximum inductor current

The highest inductor current occurs at maximum VIN.

Open core inductors have a soft saturation characteristic, and they can usually handle higher inductor currents versus a comparable shielded inductor.

A more conservative approach is to select the inductor current rating just for the maximum switch current of the TPS65022 (2 A for the VDCDC1 and VDCDC2 converters, and 1.5 A for the VDCDC3 converter). The core material from inductor to inductor differs and has an impact on the efficiency especially at high switching frequencies.

See Table 17 and the typical applications for possible inductors.

Table 17. Tested Inductors

DEVICE INDUCTOR VALUE TYPE COMPONENT SUPPLIER
DCDC3 converter 3.3 μH CDRH2D14NP-3R3 Sumida
3.3 μH LPS3010-332 Coilcraft
3.3 μH VLF4012AT-3R3M1R3 TDK
2.2 μH VLF4012AT-2R2M1R5 TDK
DCDC2 converter 3.3 μH CDRH2D18/HPNP-3R3 Sumida
3.3 μH VLF4012AT-3R3M1R3 TDK
2.2 μH VLCF4020-2R2 TDK
DCDC1 converter 3.3 μH CDRH3D14/HPNP-3R2 Sumida
3.3 μH CDRH4D28C-3R2 Sumida
3.3 μH MSS5131-332 Coilcraft
2.2 μH VLCF4020-2R2 TDK

8.2.2.2 Output Capacitor Selection

The advanced Fast Response voltage mode control scheme of the inductive converters implemented in the TPS65022 allow the use of small ceramic capacitors with a typical value of 10 μF for each converter without having large output voltage under and overshoots during heavy load transients. Ceramic capacitors having low ESR values have the lowest output voltage ripple and are recommended. See Table 18 for recommended components.

If ceramic output capacitors are used, the capacitor RMS ripple current rating always meets the application requirements. The RMS ripple current is calculated as:

Equation 6. TPS65022 q6_irms_lvs613.gif

At nominal load current, the inductive converters operate in PWM mode. The overall output voltage ripple is the sum of the voltage spike caused by the output capacitor ESR plus the voltage ripple caused by charging and discharging the output capacitor:

Equation 7. TPS65022 q7_deltav_lvs613.gif

Where the highest output voltage ripple occurs at the highest input voltage Vin.

At light load currents, the converters operate in PSM and the output voltage ripple is dependent on the output capacitor value. The output voltage ripple is set by the internal comparator delay and the external capacitor. The typical output voltage ripple is less than 1% of the nominal output voltage.

8.2.2.3 Input Capacitor Selection

Because of the nature of the buck converter having a pulsating input current, a low ESR input capacitor is required for best input voltage filtering and minimizing the interference with other circuits caused by high input voltage spikes. Each DC-DC converter requires a 10-μF ceramic input capacitor on its input pin VINDCDCx. The input capacitor is increased without any limit for better input voltage filtering. The VCC pin is separated from the input for the DC-DC converters. A filter resistor of up to 10R and a 1-μF capacitor is used for decoupling the VCC pin from switching noise. Note that the filter resistor may affect the UVLO threshold since up to 3 mA can flow through this resistor into the VCC pin when all converters are running in PWM mode.

Table 18. Possible Capacitors

CAPACITOR VALUE CASE SIZE COMPONENT SUPPLIER COMMENTS
22 μF 1206 TDK C3216X5R0J226M Ceramic
22 μF 1206 Taiyo Yuden JMK316BJ226ML Ceramic
22 μF 0805 TDK C2012X5R0J226MT Ceramic
22μF 0805 Taiyo Yuden JMK212BJ226MG Ceramic
10 μF 0805 Taiyo Yuden JMK212BJ106M Ceramic
10 μF 0805 TDK C2012X5R0J106M Ceramic

8.2.2.4 Output Voltage Selection

The DEFDCDC1, DEFDCDC2, and DEFDCDC3 pins are used to set the output voltage for each step-down converter. See Table 19 for the default voltages if the pins are pulled to GND or to VCC. If a different voltage is needed, an external resistor divider can be added to the DEFDCDCx pin as shown in Figure 36.

The output voltage of VDCDC3 is set with the I2C interface. If the voltage is changed from the default, using the DEFCORE register, the output voltage only depends on the register value. Any resistor divider at DEFDCDC3 does not change the voltage set with the register.

Table 19. DCDC1, DCDC2, and DCDC3 Default Voltage Levels

PIN LEVEL DEFAULT OUTPUT VOLTAGE
DEFDCDC1 VCC 3.3 V
GND 3 V
DEFDCDC2 VCC 2.5 V
GND 1.8 V
DEFDCDC3 VCC 1.55 V
GND 1.3 V

Using an external resistor divider at DEFDCDCx:

TPS65022 resist_divider_lvs607.gif Figure 36. External Resistor Divider

When a resistor divider is connected to DEFDCDCx, the output voltage can be set from 0.6 V up to the input voltage V(bat). The total resistance (R1 + R2) of the voltage divider should be kept in the 1-MR range in order to maintain a high efficiency at light load.

V(DEFDCDCx) = 0.6 V

Equation 8. TPS65022 q8_vout_lvs607.gif

8.2.2.5 VRTC Output

The VRTC output is typically connected to the Vcc_Batt pin of a Intel® PXA270 processor. During power-up of the processor, the TPS65022 internally switches from the LDO or the backup battery to the system voltage connected at the VSYSIN pin (see Figure 28).It is required that a 4.7-μF (minimum) capacitor be added to the VRTC pin even if the output is not used.

8.2.2.6 LDO1 and LDO2

The LDOs in the TPS65022 are general-purpose LDOs which are stable using ceramics capacitors. The minimum output capacitor required is 2.2 μF. The LDOs output voltage can be changed to different voltages between 1 V and 3.3 V using the I2C interface. Therefore, they can also be used as general-purpose LDOs in applications powering processors different from PXA270. The supply voltage for the LDOs must connect to the VINLDO pin, giving the flexibility to connect the lowest voltage available in the system and provides the highest efficiency.

8.2.2.7 TRESPWRON

This is the input to a capacitor that defines the reset delay time after the voltage at VRTC rises above 2.52 V. The timing is generated by charging and discharging the capacitor with a current of 2 μA between a threshold of 0.25 V and 1 V for 128 cycles. A 1-nF capacitor gives a delay time of 100 ms.

While there is no real upper and lower limit for the capacitor connected to TRESPWRON, do not leave signal pins open.

Equation 9. TPS65022 q_t_reset_lvs613.gif

where

  • t(reset) is the reset delay time
  • C(reset) is the capacitor connected to the TRESPWRON pin

The minimum and maximum values for the timing parameters called ICONST (2 µA), TRESPWRON_UPTH (1 V) and TRESPWRON_LOWTH (0.25 V) can be found under the electrical characteristics.

8.2.2.8 VCC-Filter

An RC filter connected at the VCC input is used to keep noise from the internal supply for the bandgap and other analog circuitry. A typical value of 10 R and 1 μF is used to filter the switching spikes, generated by the DC-DC converters. A larger resistor than 10 R should not be used because the current into VCC of up to 3 mA causes a voltage drop at the resistor causing the undervoltage lockout circuitry connected at VCC internally to switch off too early.

8.2.3 Application Curves

TPS65022 eff_33v1_io_lvs607.gif Figure 37. DCDC1 Efficiency
TPS65022 eff_155v1_io_lvs607.gif Figure 39. DCDC3 Efficiency
TPS65022 eff_18v1_io_lvs607.gif Figure 38. DCDC2 Efficiency