SLVS667B July   2006  – January 2016 TPS65022

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  VRTC Output and Operation With or Without Backup Battery
      2. 7.3.2  Step-Down Converters, VDCDC1, VDCDC2, and VDCDC3
      3. 7.3.3  Power Save Mode Operation
      4. 7.3.4  Low Ripple Mode
      5. 7.3.5  Soft-Start
      6. 7.3.6  100% Duty Cycle Low Dropout Operation
      7. 7.3.7  Active Discharge When Disabled
      8. 7.3.8  Power Good Monitoring
      9. 7.3.9  Low Dropout Voltage Regulators
      10. 7.3.10 Undervoltage Lockout
      11. 7.3.11 Power-Up Sequencing
      12. 7.3.12 System Reset + Control Signals
        1. 7.3.12.1 DEFLDO1 and DEFLDO2
        2. 7.3.12.2 Interrupt Management and the INT Pin
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
    6. 7.6 Register Maps
      1. 7.6.1 VERSION Register Address: 00h (read only)
      2. 7.6.2 PGOODZ Register Address: 01h (read only)
      3. 7.6.3 MASK Register Address: 02h (read/write) Default Value: C0h
      4. 7.6.4 REG_CTRL Register Address: 03h (read/write) Default Value: FFh
      5. 7.6.5 CON_CTRL Register Address: 04h (read/write) Default Value: B1h
      6. 7.6.6 CON_CTRL2 Register Address: 05h (read/write) Default Value: 40h
      7. 7.6.7 DEFCORE Register Address: 06h (read/write) Default Value: 14h/1Eh
      8. 7.6.8 DEFSLEW Register Address: 07h (read/write) Default Value: 06h
      9. 7.6.9 LDO_CTRL Register Address: 08h (read/write) Default Value: set with DEFLDO1 and DEFLDO2
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input Voltage Connection
      2. 8.1.2 Unused Regulators
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection for the DC-DC Converters
        2. 8.2.2.2 Output Capacitor Selection
        3. 8.2.2.3 Input Capacitor Selection
        4. 8.2.2.4 Output Voltage Selection
        5. 8.2.2.5 VRTC Output
        6. 8.2.2.6 LDO1 and LDO2
        7. 8.2.2.7 TRESPWRON
        8. 8.2.2.8 VCC-Filter
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

TMS320, OMAP, PowerPAD, E2E are trademarks of Texas Instruments.

Intel is a registered trademark of Intel Corporation.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.