SLVSD66 September   2015 TPS65233-1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Boost Converter
      2. 7.3.2 Linear Regulator and Current Limit
      3. 7.3.3 Charge Pump
      4. 7.3.4 Slew Rate Control
      5. 7.3.5 Short Circuit Protection, Hiccup, and Overtemperature Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Tone Generation
      2. 7.4.2 Serial Interface
    5. 7.5 Programming
      1. 7.5.1 I2C Update Sequence
    6. 7.6 Register Map
      1. 7.6.1 Control Register 1 - Address: 0x00H
      2. 7.6.2 Control Register 2 - Address: 0x01H
      3. 7.6.3 Status Register 1 - Address: 0x02H
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
        1. 8.2.1.1 Capacitor Selection
      2. 8.2.2 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Power Supply Recommendations

The devices are designed to operate from an input supply ranging from 4.5 V to 20 V. The input supply should be well regulated. If the input supply is located more than a few inches from the converter an additional bulk capacitance typically 100 μF may be required in addition to the ceramic bypass capacitors.