SLVSC27D July   2013  – October 2016 TPS65631W

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Simplified Schematic
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Boost Converter
      2. 8.3.2 Inverting Buck-Boost Converter
      3. 8.3.3 Soft-Start and Start-Up Sequence
      4. 8.3.4 Enable (CTRL)
      5. 8.3.5 Undervoltage Lockout
      6. 8.3.6 Short Circuit Protection
        1. 8.3.6.1 Short-Circuits During Normal Operation
        2. 8.3.6.2 Short-Circuits During Start-Up
      7. 8.3.7 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation with VI < 2.9 V
      2. 8.4.2 Operation with VI ≈ VPOS (Diode Mode)
      3. 8.4.3 Operation with CTRL
    5. 8.5 Programming
      1. 8.5.1 Programming VNEG
  9. Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Capacitor Selection
        3. 9.2.2.3 Stability
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Revision History

Changes from C Revision (January 2016) to D Revision

Changes from B Revision (April 2015) to C Revision

  • Deleted sentence in the Overview description. Go

Changes from A Revision (September 2014) to B Revision

  • Added "Outputs High Impedance During Shut Down" to Features. Go
  • Changed front-page schematic Go
  • Changed symbol for shut-down time Go
  • Added tOFF to Timing Requirements Go
  • Changed Figure 6Go
  • Deleted "Output Discharge During Shut Down" subsection Go
  • Changed "300 mA" to "200 mA" Go
  • Changed Figure 8 Go
  • Changed recommended capacitance value for C1 and C3, and reformatted table entries Go
  • Changed "2 ×10 µF " to "10 µF" Go

Changes from * Revision (July 2013) to A Revision

  • Added Device Information and Handling Rating tables, Feature Description section, Device Functional Modes, Programming section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo