SBVS437B December   2022  – February 2024 TPS7A21-Q1

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Smart Enable (EN)
      2. 6.3.2 Low Output Noise
      3. 6.3.3 Active Discharge
      4. 6.3.4 Dropout Voltage
      5. 6.3.5 Foldback Current Limit
      6. 6.3.6 Undervoltage Lockout
      7. 6.3.7 Thermal Overload Protection (TSD)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Functional Mode Comparison
      2. 6.4.2 Normal Operation
      3. 6.4.3 Dropout Operation
      4. 6.4.4 Disabled
  8. 7 Applications and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
      2. 7.1.2 Input and Output Capacitor Requirements
      3. 7.1.3 Load Transient Response
      4. 7.1.4 Undervoltage Lockout (UVLO) Operation
      5. 7.1.5 Power Dissipation (PD)
      6. 7.1.6 Estimating Junction Temperature
      7. 7.1.7 Recommended Area For Continuous Operation
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Power Dissipation and Device Operation
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.1 Layout Guidelines

The dynamic performance of the TPS7A21-Q1 is dependent on the layout of the PCB. PCB layout practices that are adequate for typical LDOs potentially degrade the PSRR, noise, or transient performance of the TPS7A21-Q1.

Best performance is achieved by placing CIN and COUT on the same side of the PCB as the TPS7A21-Q1, and as close to the package as practical. Route the ground connections for CIN and COUT back to the TPS7A21-Q1 ground pin using as wide and short a copper trace as practical.

Avoid connections using long trace lengths, narrow trace widths, or connections through vias. These connections add parasitic inductances and resistance that results in inferior performance, especially during transient conditions.