SLVSDW6C April   2017  – April 2021 TPS7H1101A-SP

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Soft Start
      2. 7.3.2 Power Good (PG)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable/Disable
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Stability
    2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
        1. 8.2.1.1 Adjustable Output Voltage (Feedback Circuit)
        2. 8.2.1.2 PCL
        3. 8.2.1.3 High-Side Current Sense
        4. 8.2.1.4 Current Foldback
        5. 8.2.1.5 Transient Response
        6. 8.2.1.6 Current Sharing
        7. 8.2.1.7 Compensation
        8. 8.2.1.8 Output Noise
        9. 8.2.1.9 Capacitors
      2. 8.2.2 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)(2)(3)TPS7H1101A-SPUNIT
HKR (CFP)
16 PINS
RθJAJunction-to-ambient thermal resistance24.3°C/W
RθJC(top)Junction-to-case (top) thermal resistance5.5°C/W
RθJBJunction-to-board thermal resistance8.1°C/W
ψJTJunction-to-top characterization parameter1.3°C/W
ψJBJunction-to-board characterization parameter8.1°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance0.4°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) Do not allow package body temperature to exceed 265°C at any time or permanent damage may result.
(3) Maximum power dissipation may be limited by overcurrent protection.