SLUSCZ1 May   2017 TPS92518-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 CSN Pin Falling Delay (tDEL)
    2. 7.2 Off-Timer (tOFF)
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  General Operation
        1. 8.3.1.1 Constant Off-Time vs. Constant µs×V operation
        2. 8.3.1.2 Output Equation
        3. 8.3.1.3 OFF Timer
          1. 8.3.1.3.1 Off-time and Maximum Off-time Calculations
      2. 8.3.2  Important System Considerations: Off-Timer and Maximum Peak Threshold Values
        1. 8.3.2.1 Peak Current Sense Comparator
        2. 8.3.2.2 Peak Current Threshold - LEDx _PKTH_DAC
        3. 8.3.2.3 Off-Time Thresholds - LEDx_TOFF_DAC and LEDx_MAXOFF_DAC
      3. 8.3.3  Shunt FET or Matrix dimming: Maximum Off-timer Calculation
        1. 8.3.3.1 Output Ringing and TPS92518-Q1 Protection
        2. 8.3.3.2 Live Peak and Off-Time Threshold Changes
      4. 8.3.4  VIN and the VCC Internal Regulators
      5. 8.3.5  Output Enable Control Logic
        1. 8.3.5.1 EN/UV2 - SPI Control Bypass
      6. 8.3.6  BOOT Capacitor and BOOT UVLO
      7. 8.3.7  Drop-out Operation
        1. 8.3.7.1 Early Drop-Out (Boot Capacitor Voltage >> VBOOT-UVLO)
        2. 8.3.7.2 Full Drop-Out (Boot Capacitor Voltage reaching VBOOT-UVLO)
        3. 8.3.7.3 Minimum BOOT Voltage and FET Control
        4. 8.3.7.4 BOOT Controlled internal Pull-Down
      8. 8.3.8  Analog and PWM Dimming
        1. 8.3.8.1 Dimming Methods
        2. 8.3.8.2 PWMx Pin Operation
        3. 8.3.8.3 PWM Dimming - Current Rise Performance
        4. 8.3.8.4 PWM and Analog Dimming - Linearity Limitations and Buck Converters
          1. 8.3.8.4.1 PWM:
          2. 8.3.8.4.2 ANALOG:
        5. 8.3.8.5 DCM Current Calculation
        6. 8.3.8.6 Current Sharing
      9. 8.3.9  VIN and CSPx Pin Configuration
      10. 8.3.10 Enable and Undervoltage Lock-out Configuration
      11. 8.3.11 Voltage Sampling and DAC Operation
        1. 8.3.11.1 ADC Control and LED Voltage Updating
      12. 8.3.12 Device Functional Modes
        1. 8.3.12.1 Analog Dimming
        2. 8.3.12.2 PWM Dimming
    4. 8.4 Serial Interface
      1. 8.4.1 Command Frame
      2. 8.4.2 Response Frame Formats
        1. 8.4.2.1 Read Response Frame Format
        2. 8.4.2.2 Write Response Frame Format
        3. 8.4.2.3 Write Error/POR Frame Format
        4. 8.4.2.4 SPI Error
    5. 8.5 Registers
      1. 8.5.1  CONTROL Register (Address = 00h) [reset = 00h]
        1. Table 3. CONTROL Register Field Descriptions
      2. 8.5.2  STATUS (FAULT) Register (Address = 01h) [reset = 10h]
        1. Table 4. STATUS Register Field Descriptions
      3. 8.5.3  THERM_WARN_LMT Register (Address = 02h) [reset = 80h]
        1. Table 5. THERM_WARN_LMT Register Field Descriptions
      4. 8.5.4  LED1_PKTH_DAC Register (Address = 03h) [reset = 80h]
        1. Table 6. LED1_PKTH_DAC Register Field Descriptions
      5. 8.5.5  LED2_PKTH_DAC Register (Address = 04h) [reset = 80h]
        1. Table 7. LED2_PKTH_DAC Register Field Descriptions
      6. 8.5.6  LED1_TOFF_DAC Register (Address = 05h) [reset = 80h]
        1. Table 8. LED1_TOFF_DAC Register Field Descriptions
      7. 8.5.7  LED2_TOFF_DAC Register (Address = 06h) [reset = 80h]
        1. Table 9. LED2_TOFF_DAC Register Field Descriptions
      8. 8.5.8  LED1_MAXOFF_DAC Register (Address = 07h) [reset = 80h]
        1. Table 10. LED1_MAXOFF_DAC Register Field Descriptions
      9. 8.5.9  LED2_MAXOFF_DAC Register (Address = 08h) [reset = 80h]
        1. Table 11. LED2_MAXOFF_DAC Register Field Descriptions
      10. 8.5.10 VTHERM Register (Address = 09h) [reset = 0h]
        1. Table 12. VTHERM Register Field Descriptions
      11. 8.5.11 LED1_MOST_RECENT Register (Address = 0Ah) [reset = 0h]
        1. Table 13. LED1_MOST_RECENT Register Field Descriptions
      12. 8.5.12 LED1_LAST_ON Register (Address = 0Bh) [reset = 0h]
        1. Table 14. LED1_LAST_ON Register Field Descriptions
      13. 8.5.13 LED1_LAST_OFF Register (Address = 0Ch) [reset = 0h]
        1. Table 15. LED1_LAST_OFF Register Field Descriptions
      14. 8.5.14 LED2_MOST_RECENT Register (Address = 0Dh) [reset = 0h]
        1. Table 16. LED2_MOST_RECENT Register Field Descriptions
      15. 8.5.15 LED2_LAST_ON Register (Address = 0Eh) [reset = 0h]
        1. Table 17. LED2_LAST_ON Register Field Descriptions
      16. 8.5.16 LED2_LAST_OFF Register (Address = 0Fh) [reset = 0h]
        1. Table 18. LED2_LAST_OFF Register Field Descriptions
      17. 8.5.17 Reset Register (Address = 10h) [reset = 0h]
        1. Table 19. Reset Register Field Descriptions
    6. 8.6 Programming
      1. 8.6.1 TPS92518-Q1 Register Typedef - Sample Code
      2. 8.6.2 Command Frame - Sample Code
      3. 8.6.3 SPI Read/Write - Sample Code
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Dos and Don'ts
  10. 10Power Supply Recommendations
    1. 10.1 Input Source Direct from Battery
    2. 10.2 Input Source from a Boost Stage
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4 Serial Interface

The 4-wire control interface is compatible with the Serial Peripheral Interface (SPI) bus. The control bus consists of four signals: SSN, SCK, MOSI, and MISO. The SSN, SCK, and MOSI pins are TTL inputs into the TPS92518-Q1 while the MISO pin is an open-drain output. The SPI bus can be configured for both star-connect and daisy chain hardware connections.

A bus transaction is initiated by a MCU on a falling edge of SSN. While SSN is low, the input data present on the MOSI pin is sampled on the rising edge of SCK, MSbit first. The output data is asserted on the MISO pin at the falling edge of SCK. The figure below shows the data transition and sampling edges of SCK.

A valid transfer requires a non-zero integer multiple of 16 SCK cycles (i.e., 16, 32, 48, etc.). If SSN is pulsed low and no SCK pulses are issued before SSN rises, a SPI error is reported. Similarly, if SSN is raised before the 16th rising edge of SCK, the transfer is aborted and a SPI error is reported. If SSN is held low after the 16th falling edge of SCK and additional SCK edges occur, the data continues to flow through the TPS92518-Q1 shift register and out the MISO pin. When SSN transitions from low-to-high, the internal digital block decodes the most recent 16 bits that were received prior to the SSN rising edge.

SSN must transition high only after a multiple of 16 SCK cycles for a transaction to be valid and not set the SPI error bit. In the case of a write transaction, the TPS92518-Q1 logic performs the requested operation when SSN transitions high. In the case of a read transaction, the read data is transferred during the next frame, regardless of whether a SPI error has occurred.

TPS92518-Q1 TPS92518_SPI_dataformat.gifFigure 33. SPI Data Format

The data bit on MOSI is shifted into an internal 16-bit shift register (MSbit first) while data is simultaneously shifted out the MISO pin. While SSN is high (bus idle), MISO is tri-stated by the open-drain driver. While SSN is low, MISO is driven according to the 16-bit data pattern being shifted out based on the prior received command. At the falling edge of SSN to begin a new transaction, MISO is driven to the MSbit of the outbound data, and is updated on each subsequent falling edge of SCK.

NOTE

The first MISO transition happens on the first falling edge AFTER the first rising edge of SCK.