SCDS200F June   2005  – January 2018 TS5A3159A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics for 5-V Supply
    6. 6.6 Electrical Characteristics for 3.3-V Supply
    7. 6.7 Electrical Characteristics for 2.5-V Supply
    8. 6.8 Electrical Characteristics for 1.8-V Supply
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12.1.1 Device Nomenclature

Table 2. Parameter Description

SYMBOLDESCRIPTION
VCOM Voltage at COM
VNC Voltage at NC
VNO Voltage at NO
ron Resistance between COM and NC or COM and NO ports when the channel is on
rpeak Peak ON-state resistance over a specified voltage range
Δron Difference of ron between channels
ron(flat) Difference between the maximum and minimum value of ron in a channel over the specified range of conditions
INC(OFF) Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the off state under worst-case input and output conditions
INC(PWROFF) Leakage current measured at the NC port during the power-down condition, V+ = 0
INO(OFF) Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the off state under worst-case input and output conditions
INO(PWROFF) Leakage current measured at the NO port during the power-down condition, V+ = 0
INC(ON) Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the on state and the output (COM) being open
INO(ON) Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the on state and the output (COM) being open
ICOM(ON) Leakage current measured at the COM port, with the corresponding channel (COM to NO or COM to NC) in the on state and the output (NC or NO) being open
ICOM(PWROFF) Leakage current measured at the COM port during the power-down condition, V+ = 0
VIH Minimum input voltage for logic high for the control input (IN)
VIL Maximum input voltage for logic low for the control input (IN)
VI Voltage at (IN)
IIH, IIL Leakage current measured at (IN)
tON Turnon time for the switch. This parameter is measured under the specified range of conditions and by the propagation delay between the digital control (IN) signal and analog outputs (COM, NC, or NO) signal when the switch is turning on.
tOFF Turnoff time for the switch. This parameter is measured under the specified range of conditions and by the propagation delay between the digital control (IN) signal and analog outputs (COM, NC, or NO) signal when the switch is turning off.
tBBM Break-before-make time. This parameter is measured under the specified range of conditions and by the propagation delay between the output of two adjacent analog channels (NC and NO) when the control signal changes state.
QC Charge injection is a measurement of unwanted signal coupling from the control (IN) input to the analog (NC, NO, or COM) output. This is measured in coulomb (C) and measured by the total charge induced due to switching of the control input. Charge injection, QC = CL  ×  ΔVO, CL is the load capacitance and ΔVO is the change in analog output voltage.
CNC(OFF) Capacitance at the NC port when the corresponding channel (NC to COM) is off
CNO(OFF) Capacitance at the NO port when the corresponding channel (NO to COM) is off
CNC(ON) Capacitance at the NC port when the corresponding channel (NC to COM) is on
CNO(ON) Capacitance at the NO port when the corresponding channel (NO to COM) is on
CCOM(ON) Capacitance at the COM port when the corresponding channel (COM to NC or COM to NO) is on
CIN Capacitance of (IN)
OISO OFF isolation of the switch is a measurement OFF-state switch impedance. This is measured in dB in a specific frequency, with the corresponding channel (NC to COM or NO to COM) in the off state.
XTALK Crosstalk is a measurement of unwanted signal coupling from an on channel to an off channel (NC to NO or NO to NC). This is measured in a specific frequency and in dB.
BW Bandwidth of the switch. This is the frequency in which the gain of an on channel is –3 dB below the DC gain.
THD Total harmonic distortion describes the signal distortion caused by the analog switch. This is defined as the ratio or root mean square (RMS) value of the second, third, and higher harmonic to the absolute magnitude of the fundamental harmonic.
I+
 Static power supply current with the control (IN) terminal at V+ or GND