SBOSA18C may   2020  – june 2023 TSV911A-Q1 , TSV912A-Q1 , TSV914A-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: TSV911A-Q1
    5. 7.5 Thermal Information: TSV912A-Q1
    6. 7.6 Thermal Information: TSV914A-Q1
    7. 7.7 Electrical Characteristics
    8. 7.8 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Rail-to-Rail Input
      2. 8.3.2 Rail-to-Rail Output
      3. 8.3.3 Overload Recovery
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Input and ESD Protection
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision B (February 2021) to Revision C (June 2023)

  • Added the SC70 package and 8-pin TSSOP package in Device Information tableGo
  • Removed the preview tag for the SOT-23 package in Device Information tableGo
  • Updated the format of the Device Information to include package leads and channel count Go
  • Updated the Device Comparison table to include newer packagesGo
  • Added pinout drawings for TSV911A-Q1 in the Pin Configurations and Functions section Go
  • Added the Thermal Information: TSV911A-Q1 sectionGo
  • Changed input offset voltage at room temperature from ±1.5 mV to ±1.85 mV in Electrical Characteristics Go
  • Deleted the Packages With an Exposed Thermal Pad sectionGo

Changes from Revision A (December 2020) to Revision B (February 2021)

  • Deleted preview tag from VSSOP package in Device Information tableGo
  • Updated thermal information for DGK (VSSOP) package in Thermal Information: TSV912A-Q1 tableGo

Changes from Revision * (June 2020) to Revision A (December 2020)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Deleted preview tag from TSSOP package in Device Information tableGo
  • Deleted Package, preview note from TSV914-Q1 pinout drawing and Pin Functions table Go
  • Added note 4 to differential input voltage in Absolute Maximum Ratings tableGo
  • Added thermal information for TSSOP (14) to Thermal Information: TSV914A-Q1 tableGo