SLUS334F August   1995  – August 2022 UC1823A , UC1825A , UC2823A , UC2823B , UC2825A , UC2825B , UC3823A , UC3823B , UC3825A , UC3825B

PRODUCTION DATA  

  1. 1Features
  2. 2Description
  3. 3Revision History
  4. 4Ordering Information
  5. 5Pin Configuration and Functions
    1.     Terminal Functions
  6. 6Specifications
    1. 6.1 ABSOLUTE MAXIMUM RATINGS
    2. 6.2 Thermal Information
    3. 6.3 ELECTRICAL CHARACTERISTICS
    4. 6.4 ELECTRICAL CHARACTERISTICS
  7. 7Application and Implementation
    1. 7.1 LEADING EDGE BLANKING
    2. 7.2 UVLO, SOFT-START AND FAULT MANAGEMENT
    3. 7.3 ACTIVE LOW OUTPUTS DURING UVLO
    4. 7.4 CONTROL METHODS
    5. 7.5 SYNCHRONIZATION
    6. 7.6 HIGH CURRENT OUTPUTS
    7. 7.7 GROUND PLANES
    8. 7.8 OPEN LOOP TEST CIRCUIT
  8. 8Device and Documentation Support
    1. 8.1 Documentation Support
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.2 Thermal Information

PACKAGE θJA θJC
J-16 80-120 28(2)
N-16 90(1) 45
DW-16 45-90(1) 25
PLCC-20 (Q package) 43-75(1) 34
LCC-20 (L package) 70-80 20(2)
(1) Specified θJA (junction to ambient) is for devices mounted to 5 in2 FR4 PC board with one ounce copper where noted. When resistance range is given, lower values are for 5 in2 aluminum PC board. Test PWB was 0.062" thick and typically used 0.635 mm trace widths for power packages and 1.3 mm trace widths for non-power packages with 100 x 100 mil probe land area at the end of each trace.
(2) θJC data values stated were derived from MIL-STD-1835B. MIL-STD-1835B states, "The baseline values shown are worst case (mean + 2s) for a 60 x 60 mil microcircuit device silicon die and applicable for devices with die sizes up to 14400 square mils. For device die size greater than 14400 square mils use the following values; dual-in-line, 11°C/W; flat pack, 10°C/W; pin grid array, 10°C/W".