SGLS274I September   2008  – November 2023 UCC27423-Q1 , UCC27424-Q1 , UCC27425-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Dissipation Ratings
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Stage
      2. 7.3.2 Output Stage
      3. 7.3.3 Enable
      4. 7.3.4 Parallel Outputs
      5. 7.3.5 Operational Waveforms and Circuit Layout
      6. 7.3.6 VDD
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Source and Sink Capabilities During Miller Plateau
        2. 8.2.2.2 Drive Current and Power Requirements
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Revision History

Changes from Revision H (October 2016) to Revision I (November 2023)

  • Deleted top-side marking and TA range from the Device Comparison Table. Refer to the Mechanical, Packaging, and Orderable Information for this informationGo
  • Changed ESD CDM rating value from ±1500 V to ±1000 V in ESD RatingsGo
  • Changed input threshold voltage values, deleted VOH output high level and VOL output low level, changed output resistance high and output resistance low values and deleted Latch-up protection from Electrical CharacteristicsGo
  • Changed UCC274323 to UCC27423 in Figure 6-9, changed Figure 6-27 and added -Q1 to part number in several graphsGo

Changes from Revision G (May 2016) to Revision H (October 2016)

  • Changed the UCC27424-Q1 pinout drawing to show two, noninverting channelsGo
  • Changed the units of the capacitors in the Parallel Outputs figure from mF to µFGo

Changes from Revision F (September 2012) to Revision G (May 2016)

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Added MSOP package information to Features and Description sections Go

Changes from Revision E (July, 2012) to Revision F (September, 2012)

  • Changed the word terminal to pin per new standardsGo
  • Removed derating factor column in dissipation ratings table, and changed the θJC value from 4.7 to 11.9, the θJA value from 50–59 to 63, and the power rating TA = 70°C (mW) value from 1370 to 873 for the DGN package. Go