SLVSC82B August   2013  – October 2015 UCC27531-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 VDD UVLO
      2. 8.3.2 Input Stage
      3. 8.3.3 Enable Function
      4. 8.3.4 Output Stage
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Driving IGBT Without Negative Bias
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Input-to-Output Configuration
          2. 9.2.1.2.2 Input Threshold Type
          3. 9.2.1.2.3 VDD Bias Supply Voltage
          4. 9.2.1.2.4 Peak Source and Sink Currents
          5. 9.2.1.2.5 Enable and Disable Function
          6. 9.2.1.2.6 Propagation Delay
          7. 9.2.1.2.7 Power Dissipation
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Driving IGBT With 13-V Negative Turn-Off Bias
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Using UCC27531-Q1 Drivers in an Inverter
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings(1)(2)(3)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply voltage VDD –0.3 35 V
Continuous OUTH, OUTL, OUT –0.3 VDD + 0.3 V
Pulse OUTH, OUTL, OUT (200 ns) –2 VDD + 0.3 V
Continuous IN, EN, IN+, IN-, IN1, IN2 –5 27 V
Pulse IN, EN, IN+, IN-, IN1, IN2 (1.5 µs) –6.5 27 V
Operating virtual junction temperature, TJ –40 150 °C
Lead temperature Soldering, 10 sec. 300 °C
Reflow 260
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND unless otherwise noted. Currents are positive into, negative out of the specified terminal. See Packaging Section of the datasheet for thermal limitations and considerations of packages.
(3) These devices are sensitive to electrostatic discharge; follow proper device handling procedures.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply voltage range, VDD 10 18 32 V
Ambient temperature range –40 140 °C
Input voltage, IN, IN+, IN-, IN1, IN2 –5 25 V
Enable, EN –5 25 V

7.4 Thermal Information

THERMAL METRIC(1) UCC27531-Q1 UNIT
DBV (SOT-23)
6 PINS
RθJA Junction-to-ambient thermal resistance 178.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 109.7 °C/W
RθJB Junction-to-board thermal resistance 28.3 °C/W
ψJT Junction-to-top characterization parameter 14.7 °C/W
ψJB Junction-to-board characterization parameter 27.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

Unless otherwise noted, VDD = 18 V, TA = –40°C to 140°C, 1-µF capacitor from VDD to GND, f = 100 kHz. Currents are positive into, negative out of the specified terminal. OUTH and OUTL are tied together for UCC27531-Q1. Typical condition specifications are at 25°C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
BIAS CURRENTS
IDDoff Startup current VDD = 7, IN, EN = VDD 100 200 300 μA
IN, EN = GND 100 217 300
UVLO
VON Supply start threshold 8 8.9 9.8 V
VOFF Minimum operating voltage after supply start 7.3 8.2 9.1 V
VDD_H Supply voltage hysteresis 0.7 V
INPUT (IN)
VIN_H Input signal high threshold, output high Output High, EN = HIGH 1.8 2 2.2 V
VIN_L Input signal low threshold, output low Output Low, EN = HIGH 0.8 1 1.2 V
VIN_HYS Input signal hysteresis 1 V
ENABLE (EN)
VEN_H Enable signal high threshold Output High 1.7 1.9 2.1 V
VEN_L Enable signal low threshold Output Low 0.8 1 1.2 V
VEN_HYS Enable signal hysteresis 0.9 V
OUTPUTS (OUTH/OUTL)
ISRC/SNK Source peak current (OUTH)/ sink peak current (OUTL) CLOAD = 0.22 µF, f = 1 kHz –2.5 / +5 A
VOH OUTH, high voltage IOUTH = –10 mA VDD - 0.2 VDD - 0.12 VDD - 0.07 V
VOL OUTL, low voltage IOUTL = 100 mA 0.065 0.125 V
ROH OUTH, pullup resistance TA = 25°C, IOUT = –10 mA 11 12 12.5 Ω
TA = –40°C to 140°C, IOUT = –10 mA 7 12 20
ROL OUTL, pulldown resistance TA = 25°C, IOUT = 100 mA 0.45 0.65 0.85 Ω
TA = –40°C to 140°C, IOUT = 100 mA 0.3 0.65 1.25

7.6 Switching Characteristics

Unless otherwise noted, VDD = 18 V, TA = –40°C to 140°C, 1-µF capacitor from VDD to GND, f = 100 kHz. Currents are positive into, negative out of the specified terminal. OUTH and OUTL are tied together for UCC27531-Q1. Typical condition specifications are at 25°C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tR Rise time CLOAD = 1.8 nF 15 ns
tF Fall time CLOAD = 1.8 nF 7 ns
tD1 Turn-on propagation delay CLOAD = 1.8 nF, IN = 0 V to 5 V 17 26 ns
tD2 Turn-off propagation delay CLOAD = 1.8 nF, IN = 5 V to 0 V 17 26 ns
UCC27531-Q1 timing_lusba7.gif Figure 1. Timing Diagram (OUTPUT = OUTH tied to OUTL) INPUT = IN,
(EN = VDD), or INPUT = EN, (IN = VDD)

7.7 Typical Characteristics

If not specified, INPUT refers to non-inverting input
UCC27531-Q1 C001_SLUSBA7.gif Figure 2. Rise Time vs Supply Voltage
UCC27531-Q1 C003_SLUSBA7.gif
Figure 4. Propagation Delay vs Supply Voltage
UCC27531-Q1 newfig8_SLUSBA7.gif Figure 6. Operating Supply Current vs Frequency
UCC27531-Q1 C006_SLUSBA7.gif Figure 8. Operating Supply Current vs Temperature (Output Switching)
UCC27531-Q1 C008_SLUSBA7.png Figure 10. Input Threshold vs Temperature
UCC27531-Q1 C010_SLUSBA7.gif Figure 12. Output Pullup Resistance vs Temperature
UCC27531-Q1 C012_SLUSBA7.gif Figure 14. Operating Supply Current vs Temperature (Output in DC ON/OFF Condition)
UCC27531-Q1 C017a_SLVSBA7C.gif Figure 16. IN- Input-to-Output Propagation Delay vs Temperature
UCC27531-Q1 C015_SLUSBA7.gif Figure 18. Fall Time vs Temperature
UCC27531-Q1 C017_SLUSBA7.png Figure 20. Rise Time vs Supply Voltage
UCC27531-Q1 C002_SLUSBA7.gif Figure 3. Fall Time vs Supply Voltage
UCC27531-Q1 C007a_SLVSBA7C.png Figure 5. IN - Propagation Delay vs Supply
UCC27531-Q1 new21curve_SLUSBA7.gif Figure 7. Start-Up Current vs Temperature
UCC27531-Q1 C007_SLUSBA7.png Figure 9. UVLO Threshold Voltage vs Temperature
UCC27531-Q1 C009_SLUSBA7.png Figure 11. Enable Threshold vs Temperature
UCC27531-Q1 C011_SLUSBA7.gif Figure 13. Output Pulldown Resistance vs Temperature
UCC27531-Q1 C013_SLUSBA7.gif Figure 15. Input-to-Output Propagation Delay vs Temperature
UCC27531-Q1 C014_SLUSBA7.gif Figure 17. Rise Time vs Temperature
UCC27531-Q1 C016_SLUSBA7.gif Figure 19. Operating Supply Current vs Supply Voltage (Output Switching)
UCC27531-Q1 C018_SLUSBA7.gif Figure 21. Fall Time vs Supply Voltage