SLUSFA6 October   2023 UCC44273

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VDD and Undervoltage Lockout
      2. 7.3.2 Operating Supply Current
      3. 7.3.3 Input Stage
      4. 7.3.4 Output Stage
      5. 7.3.5 Low Propagation Delays
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Threshold Type
        2. 8.2.2.2 VDD Bias Supply Voltage
        3. 8.2.2.3 Peak Source and Sink Currents
        4. 8.2.2.4 Propagation Delay
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Thermal Considerations
      4. 8.4.4 Power Dissipation
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Input Stage

The input pin of the UCC44273 is based on a TTL and CMOS compatible input-threshold logic that is independent of the VDD supply voltage. With typical high threshold = 2.2 V and typ low threshold = 1.2 V, the logic-level thresholds can be conveniently driven with PWM-control signals derived from 3.3-V and 5-V digital-power controllers. Wider hysteresis (typically 1 V) offers enhanced noise immunity compared to traditional TTL-logic implementations, where the hysteresis is typically less than 0.5 V. These devices also feature tight control of the input-pin threshold-voltage levels which eases system-design considerations and ensures stable operation across temperature. The very low input capacitance on these pins reduces loading and increases switching speed.

The device features an important protection function wherein, whenever the input pin is in a floating condition, the output of the driver is held in the low state. This is achieved using GND-pulldown resistors on the non-inverting input pin (IN pin), (refer to Section 7.2).

The input stage of the driver should preferably be driven by a signal with a short rise or fall time. Caution must be exercised whenever the driver is used with slowly-varying input signals, especially in situations where the device is located in a mechanical socket or PCB layout is not optimal:

  • High dI/dt current from the driver output coupled with board layout parasitics causes ground bounce. Because the device features just one GND pin, which may be referenced to the power ground, the differential voltage between input pins and GND is modified and triggers an unintended change of output state. Because of fast 13-ns propagation delay, high-frequency oscillations ultimately occur, which increases power dissipation and poses risk of damage.
  • 1-V input-threshold hysteresis boosts noise immunity compared to most other industry-standard drivers.
  • In the worst case, when a slow input signal is used and PCB layout is not optimal, adding a small capacitor (1 nF) between input pin and ground very close to the driver device is necessary. This helps to convert the differential mode noise with respect to the input-logic circuitry into common-mode noise and avoid unintended change of output state.

If limiting the rise or fall times to the power device is the primary goal, then an external resistance is highly recommended between the output of the driver and the power device instead of adding delays on the input signal. This external resistor has the additional benefit of reducing part of the gate charge related power dissipation in the gate-driver device package and transferring the gate driver into the external resistor.